209823 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the layer connector in liquid form Screen printing, i.e. using a stencil
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2ELECTRONIC DEVICE AND FLIP-CHIP DIE ASSEMBLY WITH PREFORMED UNDERFILL AND STUD BUMPS
#3CURABLE COMPOSITION FOR FORMING ADHESIVE STRUCTURE, ADHESIVE STRUCTURE, METHOD OF MANUFACTURING ADHESIVE STRUCTURE, AND SEMICONDUCTOR DEVICE
#4SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#5SELECTIVE TRANSFER OF MICRO DEVICES
#6SEMICONDUCTOR DEVICE AND ELECTRIC POWER CONVERSION DEVICE
#7IN-CAVITY EPOXY PLACEMENT FOR PACKAGE RELIABILITY
#8SELECTIVE MICRO DEVICE TRANSFER TO RECEIVER SUBSTRATE
#9SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#10SELECTIVE TRANSFER OF MICRO DEVICES
#11SINTERING FILM FRAMES AND RELATED METHODS
#12FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
#13SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD
#14INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
#15MULTI-BARRIER SYSTEM FOR LOW-VOID THERMAL TRANSFER
#16LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL
#17LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
#18METHOD OF PRODUCING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#19SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME
#20IMAGE SENSOR PACKAGING STRUCTURES AND RELATED METHODS
#21SEMICONDUCTOR APPARATUS
#22Semiconductor device and method for manufacturing the same
#23ADHESIVE BONDING COMPOSITION AND METHOD OF USE
#24ADHESIVE TRANSFER FILM AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE BY USING SAME
#25Deposit levelling
#26ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#27Fingerprint sensor and manufacturing method thereof
#28SINTERING COMPOSITION
#29COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
#30Circuits including micropatterns and using partial curing to adhere dies
#31Selective micro device transfer to receiver substrate
#32Selective micro device transfer to receiver substrate
#33Selective micro device transfer to receiver substrate
#34Selective micro device transfer to receiver substrate
#35Method of producing semiconductor devices and corresponding semiconductor device
#36Selective micro device transfer to receiver substrate
#37Selective micro device transfer to receiver substrate
#38Method of applying conductive adhesive and manufacturing device using the same
#39Selective transfer of micro devices
#40Packaging structure of a SiC MOSFET power module and manufacturing method thereof
#41Semiconductor device
#42Adhesive bonding composition and method of use
#43Selective micro device transfer to receiver substrate
#44Semiconductor devices and methods of making the same
#45Assembly process for circuit carrier and circuit carrier
#46Method of manufacturing an electronic device
#47Fingerprint sensor and manufacturing method thereof
#48LOGIC POWER MODULE WITH A THICK-FILM PASTE MEDIATED SUBSTRATE BONDED WITH METAL OR METAL HYBRID FOILS
#49Method of fabricating high-power module
#50Method of applying conductive adhesive and manufacturing device using the same
#51Semiconductor device manufacturing method
#52Process of assembling semiconductor device
#53Die attach methods and semiconductor devices manufactured based on such methods
#54Adhesive bonding composition and method of use
#55Device package with reduced radio frequency losses
#56Wafer level flat no-lead semiconductor packages and methods of manufacture
#57Wafer level flat no-lead semiconductor packages and methods of manufacture
#58Wafer level flat no-lead semiconductor packages and methods of manufacture
#59Placement method for circuit carrier and circuit carrier
#60Conductive paste and die bonding method
#61Molded air cavity packages and methods for the production thereof
#62Electronic device package with recessed substrate for underfill containment
#63Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
#64Molded air cavity packages and methods for the production thereof
#65Power electronics assembly having an adhesion layer, and method for producing said assembly
#66Semiconductor device and method for manufacturing the same
#67Ag underlayer-attached metallic member, Ag underlayer-attached insulating circuit substrate,semiconductor device, heat sink-attached insulating circuit substrate, and method for manufacturing Ag underlayer-attached metallic member
#68Semiconductor device
#69Electronic component device
#70Electronic sandwich structure with two parts joined together by means of a sintering layer
#71Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic component
#72Resin composition, copper paste, and semiconductor device
#73Clip and related methods
#74Wafer level flat no-lead semiconductor packages and methods of manufacture
#75Conductive paste for bonding
#76Conductive paste for bonding
#77Semiconductor device with plated lead frame
#78Engineered polymer-based electronic materials
#79POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIFFUSION BARRIER LAYER AND A SEMICONDUCTOR ELEMENT CONNECTED THERETO BY MEANS OF SINTERING, AND METHOD FOR PRODUCING SAME
#80Chip carrier and method thereof
#81Die attach methods and semiconductor devices manufactured based on such methods
#82Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#83Packaged IC With Solderable Sidewalls
#84Fan-out wafer level chip package structure
#85Semiconductor device and method of manufacturing the same
#86Nanomicrocrystallite paste for pressureless sintering
#87Electronic device and method for producing an electronic device
#88Solder paste
#89Fingerprint sensor and manufacturing method thereof
#90Methods for bonding substrates
#91Packaged IC with solderable sidewalls
#92Method for fabricating stack die package
#93LIQUID RESIN COMPOSITION, DIE ATTACHING METHOD USING SAME AND SEMICONDUCTOR DEVICE HAVING CURED PRODUCT OF SAME
#94Adhesive bonding composition and method of use
#95Sintering materials and attachment methods using same
#96Clip and related methods
#97Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#98Semiconductor devices and methods of making the same
#99Printed interconnects for semiconductor packages
#100Method for manufacturing metal powder
#101ASSEMBLY COMPRISING TWO ELEMENTS OF DIFFERENT THERMAL EXPANSION COEFFICIENTS AND A SINTERED JOINT OF HETEROGENEOUS DENSITY AND PROCESS FOR MANUFACTURING THE ASSEMBLY
#102Assembly comprising an element that is capable of transmitting heat, a film of a polymer that is a good thermal conductor and electrical insulator, a sintered joint and a radiator and manufacturing method
#103Method and apparatus for assembling a component with a flexible foil, as well as the assembled product
#104Alternative compositions for high temperature soldering applications
#105Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#106Semiconductor arrangement, semiconductor system and method of forming a semiconductor arrangement
#107Power module packaging structure and method for manufacturing the same
#108Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#109Wafer stack protection seal
#110Electronic component module and method for manufacturing electronic component module
#111Fingerprint sensor and manufacturing method thereof
#112Au-based solder die attachment semiconductor device and method for manufacturing the same
#113Bonding apparatus
#114Fan out system in package and method for forming the same
#115System in package fan out stacking architecture and process flow
#116Method for manufacturing semiconductor device
#117Electrical connection material
#118Microfluidic delivery member with filter and method of forming same
#119Semiconductor module
#120Pre-applying supporting materials between bonded package components
#121Method for producing a material-bonding connection between a semiconductor chip and a metal layer
#122Fan-out wafer level chip package structure and manufacturing method thereof
#123Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#124Contact smart card
#125Electronic devices with semiconductor die coupled to a thermally conductive substrate
#126Adhesive for mounting flip chip for use in a method for producing a semiconductor device
#127Thin plastic leadless package with exposed metal die paddle
#128Low-stress dual underfill packaging
#129Method for producing a circuit board element
#130Miniaturized SMD diode package and process for producing the same
#131Wafer level flat no-lead semiconductor packages and methods of manufacture
#132Ultra-thin power transistor and synchronous buck converter having customized footprint
#133Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure
#134Embedded semiconductor device package and method of manufacturing thereof
#135Semiconductor device having a device fixed on a substrate with an adhesive
#136Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#137GaN power device with solderable back metal
#138Substrate
#139Integrated circuit package and method of making same
#140Semiconductor device including semiconductor chips mounted over both surfaces of substrate
#141Package structure and packaging method of wafer level chip scale package
#142Low-stress dual underfill packaging
#143Underfill composition for encapsulating a bond line
#144Semiconductor device with plated lead frame, and method for manufacturing thereof
#145Solder paste, joining method using the same and joined structure
#146Semiconductor device including independent film layer for embedding and/or spacing semiconductor die
#147Silver paste composition and semiconductor device using same
#148Miniaturized SMD diode package and process for producing the same
#149Array based fabrication of power semiconductor package with integrated heat spreader
#150Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#151Electric component mounting method
#152Conductive paste and die bonding method
#153Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package
#154Method for processing a wafer and wafer structure
#155Embedded semiconductor device package and method of manufacturing thereof
#156Metallic particle paste, cured product using same, and semiconductor device
#157Lead frame having a perimeter recess within periphery of component terminal
#158Semiconductor package with embedded die and its methods of fabrication
#159Semiconductor package and method of manufacturing the same
#160Bonding structure including metal nano particle
#161Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig
#162Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding
#163Connection arrangement of an electric and/or electronic component
#164Method for producing a semiconductor module by using an adhesion carrier
#165Joining method, method for producing electronic device and electronic part
#166Coreless integrated circuit packaging system and method of manufacture thereof
#167Method for fabricating stack die package
#168Wafer stack protection seal
#169Balanced stress assembly for semiconductor devices
#170Method of bonding semiconductor elements and junction structure
#171Method for producing structured sintered connection layers, and semiconductor element having a structured sintered connection layer
#172Solderless die attach to a direct bonded aluminum substrate
#173Pre-applying supporting materials between bonded package components
#174Stacked type power device module
#175Semiconductor packaging containing sintering die-attach material
#176Bonding material comprising coated silver nanoparticles and bonded object produced using same
#177Methods for bonding substrates
#178Bondable top metal contacts for gallium nitride power devices
#179GaN power device with solderable back metal
#180Methods for producing a bond and a semiconductor module
#181Semiconductor device and method of manufacturing the same
#182Integrated circuit package and method of making same
#183Solderless die attach to a direct bonded aluminum substrate
#184Bonding material and bonding body, and bonding method
#185Production method for polyamide acid particles, production method for polyimide particles, polyimide particles and bonding material for electronic component
#186Methods for forming semiconductor device packages
#187Semiconductor device including a polymer disposed on a carrier
#188STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT
#189Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
#190Embedded electrical component surface interconnect
#191Semiconductor device using diffusion soldering
#192Wafer dicing employing edge region underfill removal
#193Curable amine, carboxylic acid flux composition and method of soldering
#194Curable flux composition and method of soldering
#195PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
#196Method for manufacturing wafer-bonded semiconductor device
#197Power semiconductor chip having two metal layers on one face
#198Method for manufacturing a semiconductor package
#199Conductive connecting member and manufacturing method of same
#200Electrically conductive paste, and electrically conducive connection member produced using the paste
#201Package structure, method for manufacturing same, and method for repairing package structure
#202METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
#203Wafer level package with thermal pad for higher power dissipation
#204EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
#205SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME
#206Ultra-thin power transistor and synchronous buck converter having customized footprint
#207Solder paste, joining method using the same and joined structure
#208Sintering materials and attachment methods using same
#209DISCRETE CIRCUIT COMPONENT HAVING COPPER BLOCK ELECTRODES AND METHOD OF FABRICATION
#210Method of producing a chip package, and chip package
#211Semiconductor packages and methods of fabricating the same
#212SEMICONDUCTOR DEVICE
#213Method for mounting luminescent device
#214Apparatus for applying solder to semiconductor chips using decals with aperatures present therein
#215Method for manufacturing semiconductor device and semiconductor manufacturing apparatus
#216Method for manufacturing semiconductor device
#217Die level integrated interconnect decal manufacturing method and apparatus
#218Wafer level integrated interconnect decal and manufacturing method thereof
#219Semiconductor package with embedded die and its methods of fabrication
#220Chip package and fabrication method thereof
#221Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material
#222Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element
#223LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM
#224WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP
#225WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES
#226Electronic component mounting structure
#227PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER
#228Semiconductor chip assembly
#229I/O pad structures for integrated circuit devices
#230Thin plastic leadless package with exposed metal die paddle
#231Methods of attaching a die to a substrate
#232SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#233Wiring substrate, method of manufacturing wiring substrate, and electronic apparatus
#234Structure of power semiconductor with twin metal and ceramic plates
#235Stencil and method for depositing material onto a substrate
#236Wiring carrier design
#237Semiconductor device and fabrication method for the same