Patents-Review.com
ClassID:

209825 ⎘

H01L2224/27332 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by local deposition of the material of the layer connector in solid form using a powder

Recent Application in this class:
#1
20250336874
2025-10-30

SINTERING FOR SEMICONDUCTOR DEVICE ASSEMBLIES

 #2
20240413117
2024-12-12

LOW PRESSURE SINTERING POWDER

 #3
20220045027
2022-02-10

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #4
20210249376
2021-08-12

Low pressure sintering powder

 #5
20200248040
2020-08-06

Method of manufacturing an electronic device

 #6
20200152352
2020-05-14

Anisotropic electrically conductive film, method for producing same, and connection structural body

 #7
20190148320
2019-05-16

Electronic element and electronic device comprising the same

 #8
20180331063
2018-11-15

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

 #9
20180072923
2018-03-15

Conductive paste for bonding

 #10
20170348806
2017-12-07

SOLDER PASTE

 #11
20170144221
2017-05-25

Sintering materials and attachment methods using same

 #12
20170092611
2017-03-30

POROUS METALLIC FILM AS DIE ATTACH AND INTERCONNECT

 #13
20170062304
2017-03-02

Multi-step processes for high temperature bonding and bonded substrates formed therefrom

 #14
20170033073
2017-02-02

Low pressure sintering powder

 #15
20160254243
2016-09-01

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR JOINING ELECTRONIC PART

 #16
20160225735
2016-08-04

Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods

 #17
20150246417
2015-09-03

Mixed alloy solder paste

 #18
20150224602
2015-08-13

Mixed alloy solder paste

 #19
20150200177
2015-07-16

WAFER LEVEL PACKAGE WITH REDISTRIBUTION LAYER FORMED WITH METALLIC POWDER

 #20
20150021792
2015-01-22

Electronic device and method for fabricating an electronic device

 #21
20140374775
2014-12-25

Electronic component and manufacturing method for electronic component

 #22
20140367701
2014-12-18

Semiconductor device

 #23
20140001634
2014-01-02

Method for manufacturing a chip package

 #24
20130256894
2013-10-03

Porous Metallic Film as Die Attach and Interconnect

 #25
20130175330
2013-07-11

Method for making a solder joint

 #26
20130001803
2013-01-03

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

 #27
20110290863
2011-12-01

Sintering silver paste material and method for bonding semiconductor chip

 #28
20110268985
2011-11-03

Mixed alloy solder paste

 #29
20090242121
2009-10-01

LOW STRESS, LOW-TEMPERATURE METAL-METAL COMPOSITE FLIP CHIP INTERCONNECT

 #30
20070183920
2007-08-09

Nanoscale metal paste for interconnect and method of use

 #31
20050127134
2005-06-16

Nano-metal composite made by deposition from colloidal suspensions