209863 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material Physical or chemical etching
Sub-classes:SEMICONDUCTOR PACKAGING
#2HIGH-PRECISION HETEROGENEOUS INTEGRATION
#3INTEGRATED CIRCUIT PACKAGE
#4SEMICONDUCTOR PACKAGING
#5DISPLAY DEVICE AND METHOD FOR FABRICATION THEREOF
#6Seal ring structures and methods of forming same
#7Seal ring structures and methods of forming same
#8Nanoscale interconnect array for stacked dies
#9Seal ring structures and methods of forming same
#10Embedded graphite heat spreader for 3DIC
#11Seal ring structures and methods of forming same
#12Nanoscale interconnect array for stacked dies
#13Die attachment for packaged semiconductor device
#14Wafer stack protection seal
#15Embedded graphite heat spreader for 3DIC
#16Die attachment for packaged semiconductor device
#17Sealing structure for a bonded wafer and method of forming the sealing structure
#18Wafer-level die attach metallization
#19Wafer stack protection seal
#20Method and apparatus for a wafer seal ring
#21Bump package and methods of formation thereof
#22Method of fabricating a TSV for 3D packaging of semiconductor device
#23Manufacturing method for electronic devices
#24Manufacturing method for electronic devices
#25Detection device and method for manufacturing the same
#26Electronic component mounting structure
#27Manufacturing method for electronic devices