209865 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods by patterning a pre-deposited material; Physical or chemical etching by chemical means only
WAFER-TO-WAFER BONDING STRUCTURE AND FABRICATION METHOD THEREOF
#2CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONIC DEVICES
#3SEMICONDUCTOR PACKAGE COMPRISING DAM AND MULTI-LAYERED UNDER-FILL LAYER
#4PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#5PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#6WET ATOMIC LAYER ETCHING METHOD AND METHOD OF MANUFACTURING THE SAME
#7INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#8CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD OF MANUFACTURE
#9INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE
#10NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP PACKAGE STRUCTURE, AND METHOD FOR PACKAGING CHIP
#11Capacitive coupling in a direct-bonded interface for microelectronic devices
#12Method of manufacturing die stack structure
#13UNFOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING AN UNFOLDABLE LAYERED CONNECTION
#14Semiconductor wafer and method of manufacturing the same
#15Soldering a conductor to an aluminum metallization
#16Capacitive coupling in a direct-bonded interface for microelectronic devices
#17Integration and bonding of micro-devices into system substrate
#18Soldering a conductor to an aluminum metallization
#19Soldering a conductor to an aluminum metallization
#20Integration and bonding of micro-devices into system substrate
#21Die stack structure with hybrid bonding structure and method of fabricating the same and package
#22Capacitive coupling in a direct-bonded interface for microelectronic devices
#23Laterally extended conductive bump buffer
#24Soldering a conductor to an aluminum metallization
#25Ultrathin layer for forming a capacitive interface between joined integrated circuit component
#26Ultrathin layer for forming a capacitive interface between joined integrated circuit components
#27Vertically integrated wafers with thermal dissipation
#28Wafer to wafer bonding process and structures
#29Vertically integrated wafers with thermal dissipation
#30Package structure and substrate bonding method
#31Semiconductor flip-chip package and method for the fabrication thereof