209881 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the layer connector; Applying permanent coating, e.g. in-situ coating Physical vapour deposition [PVD], e.g. evaporation, or sputtering
Reducing formation of oxide on solder
#2Solder, solder joint structure and method of forming solder joint structure
#3Bump package and methods of formation thereof
#4Reducing formation of oxide on solder