209939 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector; Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
3-D IC in Embedded Die Substrate
#2POWER MODULE, POWER SUPPLY CIRCUIT, AND CHIP
#3Power Semiconductor Module and Manufacturing Method
#4Semiconductor structure and method for forming the same
#5Semiconductor structure and method for forming the same
#6Package comprising a substrate with interconnect routing over solder resist layer and an integrated device coupled to the substrate and method for manufacturing the package
#7Power inverter module with reduced inductance
#8Method of manufacturing an electronic device
#9Semiconductor package
#10Method for fabricating glass substrate package
#11Power module assembly with dual substrates and reduced inductance
#12Conductive paste for bonding
#13Method for fabricating glass substrate package
#14Semiconductor module
#15Embedded component package structure and method of manufacturing the same
#16Method of manufacturing a flip chip package and apparatus to attach a semiconductor chip used in the method
#17High density chip stacked package, package-on-package and method of fabricating the same