209941 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector; Material at the bonding interface
Semiconductor Device and Connecting Method
#2SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFACTURING
#3SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
#4SEMICONDUCTOR PACKAGE
#5HYBRID MANUFACTURING FOR INTEGRATED CIRCUIT DEVICES AND ASSEMBLIES
#6METAL BUMPS AND METHOD FORMING SAME
#7METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
#8Advanced Device Assembly Structures And Methods
#9FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
#10METHODS OF FORMING SEMICONDUCTOR PACKAGES
#11HEATSINK FOR RING TYPE INTEGRATED CIRCUITS
#12Hybrid manufacturing for integrated circuit devices and assemblies
#13ANISOTROPIC CONDUCTIVE FILM AND DISPLAY DEVICE INCLUDING SAME
#14SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND MANUFACTURE METHOD FOR SEMICONDUCTOR STRUCTURE
#15Methods of forming semiconductor packages
#16SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFACTURING
#17Method of manufacturing a semiconductor device including bonding layer and adsorption layer
#18Semiconductor device and method of manufacturing the same
#19Hybrid manufacturing for integrated circuit devices and assemblies
#20Hybrid manufacturing of microeletronic assemblies with first and second integrated circuit structures
#21Advanced device assembly structures and methods
#22Display module and method of manufacturing the same
#23Semiconductor package and method
#24Metal bumps and method forming same
#25Semiconductor devices including bonding layer and adsorption layer
#26Chip interconnection structure, wafer interconnection structure and method for manufacturing the same
#27Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
#28Anodic Bonding of a Substrate of Glass having Contact Vias to a Substrate of Silicon
#29Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#30Ceramic circuit substrate
#31Anodic bonding of a substrate of glass having contact vias to a substrate of silicon
#32Metal bumps and method forming same
#33SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#34Semiconductor package and method
#35Member for semiconductor device
#36Semiconductor device and optical coupling device
#37Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#38Low-temperature bonding with spaced nanorods and eutectic alloys
#39THERMAL DISSIPATION USING ANISOTROPIC CONDUCTIVE MATERIAL
#40POWER ELECTRONICS MODULE WITH A SUPPORT WITH A PALLADIUM/OXYGEN DIFFUSION BARRIER LAYER AND A SEMICONDUCTOR ELEMENT CONNECTED THERETO BY MEANS OF SINTERING, AND METHOD FOR PRODUCING SAME
#41Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#42Semiconductor device
#43Monolithic integration of semiconductor materials
#44Semiconductor package structure and method for forming the same
#45Method of bonding semiconductor substrates
#46SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING OF ELEMENTS
#47DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER
#48Methods and apparatuses for high temperature bonding and bonded substrates having variable porosity distribution formed therefrom
#49Method for producing member for semiconductor device and semiconductor device, and member for semiconductor device
#50Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers
#51Anisotropic conductive film and production method of the same
#52Semiconductor device and optical coupling device
#53Power-module substrate unit and power module
#54Semiconductor package structure and method for forming the same
#55Electronic devices with encapsulating silicone based adhesive
#56SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#57Lead frames with wettable flanks
#58ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MOUNTING FLIP CHIP
#59Low-Temperature Bonding and Sealing With Spaced Nanorods
#60Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof
#61Method of forming an interconnection and arrangement for a direct interconnect chip assembly
#62Semiconductor device and manufacturing method of semiconductor device
#63PREFERRED ORIENTED AU FILM, METHOD FOR PREPARING THE SAME AND BONDING STRUCTURE COMPRISING THE SAME
#64Die warpage control for thin die assembly
#65Mounting method
#66Electronic device including soldered surface-mount component
#67Ultra-thin embedded semiconductor device package and method of manufacturing thereof
#68SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#69Semiconductor device
#70Semiconductor device
#71Method for bonding substrates
#72Semiconductor device and method for manufacturing the same
#73Semiconductor device and electronic device having the same
#74Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
#75Advanced device assembly structures and methods
#76Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bonding
#77Method for soldering surface-mount component and surface-mount component
#78Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
#79Semiconductor laser mounting for improved frequency stability
#80Semiconductor device and production method therefor
#81Semiconductor device
#82Semiconductor device and electronic device having the same