209942 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector; Material outside the bonding interface, e.g. in the bulk of the layer connector
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING OF THE SEMICONDUCTOR DEVICE
#2DIELECTRIC BLOCKING LAYER AND METHOD FORMING THE SAME
#3WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE MANUFACTURED USING THE SAME
#4MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
#5FILLER-CONTAINING FILM
#6METHOD OF SURFACE MODIFICATION FOR WAFER BONDING
#7SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD FOR MAKING THE SAME
#8Advanced Device Assembly Structures And Methods
#9HEAT DISSIPATION IN SEMICONDUCTOR DEVICES
#10METHOD OF INTERCONNECTING SEMICONDUCTOR DEVICES AND ASSEMBLY OF INTERCONNECTED SEMICONDUCTOR DEVICES
#11Dielectric Blocking Layer and Method Forming the Same
#12SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONNECT LAYER FOR HIGH POWER ELECTRONICS
#13Connection structure and manufacturing method therefor
#14Semiconductor device with enhanced thermal dissipation and method for making the same
#15Microelectronic structures including bridges
#16Advanced device assembly structures and methods
#17Display device
#18FILLER-CONTAINING FILM
#19Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant
#20METHOD FOR FABRICATING AN ELECTRONIC DEVICE
#21Display device incorporating self-assembled monolayer and method of manufacturing the same
#22Power semiconductor module
#23Semiconductor device with enhanced thermal dissipation and method for making the same
#24SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#25Semiconductor device and optical coupling device
#26Electronic packaging structure
#27Multi-layered composite bonding materials and power electronics assemblies incorporating the same
#28Bonding interface layer
#29Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module
#30Semiconductor device and optical coupling device
#31Copper-ceramic bonded body and power module substrate
#32Au-based solder die attachment semiconductor device and method for manufacturing the same
#33Method of bonding with silver paste
#34Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device
#35Process for connecting joining parts
#36Die warpage control for thin die assembly
#37Mounting method
#38SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#39Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package
#40Joint material, and jointed body
#41Advanced device assembly structures and methods
#42Package structure and the method to manufacture thereof
#43Electrically conductive paste, and electrically conducive connection member produced using the paste
#44Method and structure for wafer to wafer bonding in semiconductor packaging
#45Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material
#46Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
#47ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#48No-flow underfill composition and method
#49No-flow underfill composition and method