209952 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors Material
Sub-classes:METHOD OF FORMING SEMICONDUCTOR STRUCTURE
#2SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#3METHOD OF FORMING SEMICONDUCTOR STRUCTURE
#4SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#5SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
#6Semiconductor structure and method of forming the same
#7Semiconductor structure and forming method thereof
#8CHIP ASSEMBLIES EMPLOYING SOLDER BONDS TO BACK-SIDE LANDS INCLUDING AN ELECTROLYTIC NICKEL LAYER
#9Semiconductor package, interposer and semiconductor process for manufacturing the same
#10Semiconductor integrated circuit device
#11INTEGRATED CIRCUIT PACKAGE WITH POWER PLATES
#12Semiconductor device
#13Semiconductor integrated circuit device
#14METHOD FOR LOW TEMPERATURE BONDING OF ELECTRONIC COMPONENTS
#15Chip package and fabricating method thereof
#16Method for low temperature bonding of electronic components