209953 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto; Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors; Material Layer connectors having different materials
STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
#2STRUCTURE AND FORMATION METHOD OF PACKAGE WITH HEAT-SPREADING LID
#3MICROELECTRONIC STRUCTURES INCLUDING BRIDGES
#4ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
#5ENCAPSULATED WCSP WITH THERMAL PAD FOR EFFICIENT HEAT DISSIPATION
#6BRIDGE INTERCONNECTION WITH LAYERED INTERCONNECT STRUCTURES
#7CHIP PACKAGE STRUCTURE
#8ELECTRONIC DEVICE AND DISPLAY DEVICE USING THE SAME
#9POWER MODULE
#10SEMICONDUCTOR PACKAGING DEVICE AND HEAT DISSIPATION COVER THEREOF
#11CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#12Integrated Circuit Package and Method
#13SEMICONDUCTOR PACKAGE
#14DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
#15SEMICONDUCTOR PACKAGE AND IMAGE SENSOR PACKAGE
#16WAFER BONDING METHOD AND SEMICONDUCTOR STRUCTURE OBTAINED BY THE SAME
#17Bridge interconnection with layered interconnect structures
#18SEMICONDUCTOR DEVICE
#19SEMICONDUCTOR DEVICE
#20Integrated circuit package and method
#21Microelectronic structures including bridges
#22Electronic device and display device using the same
#23Light-emitting device
#24Systems and methods for multi-color LED pixel unit with vertical light emission
#25Bridge interconnection with layered interconnect structures
#26Electronic apparatus
#27Integrated circuit package and method
#28Plurality of heat sinks for a semiconductor package
#29SYSTEMS AND METHODS FOR FLASH STACKING
#30Semiconductor device comprising a can housing a semiconductor die which is embedded by an encapsulant
#31DAM FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT
#32Multi layer thermal interface material
#33Component having a buffer layer and method for producing a component
#34Systems and methods for flash stacking
#35Semiconductor with external electrode
#36Semiconductor package having recessed adhesive layer between stacked chips
#37Semiconductor device, method for manufacturing the same, and power conversion device
#38Bridge interconnection with layered interconnect structures
#39Systems and methods for flash stacking
#40PHYSICAL QUANTITY MEASUREMENT DEVICE AND METHOD FOR MANUFACTURING SAME, AND PHYSICAL QUANTITY MEASUREMENT ELEMENT
#41Semiconductor devices including a metal silicide layer and methods for manufacturing thereof
#42Semiconductor device and dicing method
#43Device and method for producing a device
#44Conductor design for integrated magnetic devices
#45Multilayer frame packages for integrated circuits having a magnetic shield integrated therein, and methods therefor
#46Bridge interconnection with layered interconnect structures
#47Electronic packaging structure
#48Dam for three-dimensional integrated circuit
#49Semiconductor device
#50Semiconductor device with solders of different melting points and method of manufacturing
#51SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS
#52Package-on-package semiconductor device
#53Method for manufacturing semiconductor device
#54Die attachment for packaged semiconductor device
#55Method for producing a light emitting device
#56Magnetic shielding of MRAM package
#57Method for coating conductive substrate with adhesive
#58Package-on-package semiconductor device
#59Chip package assembly and manufacturing method thereof
#60Semiconductor device and manufacturing method for the semiconductor device
#61Die attachment for packaged semiconductor device
#62Semiconductor device
#63Bridge interconnection with layered interconnect structures
#64CONDUCTOR DESIGN FOR INTEGRATED MAGNETIC DEVICES
#65Dam for three-dimensional integrated circuit
#66Semiconductor package with multi-level die block
#67Electronic component and manufacturing method for electronic component
#68Bridge interconnection with layered interconnect structures
#69Stacked type semiconductor device and printed circuit board
#70Packaged IC having printed dielectric adhesive on die pad
#71Hybrid thermal interface material for IC packages with integrated heat spreader
#72Chip package and method for assembling chip package
#73Semiconductor device including a polymer disposed on a carrier
#74Flip chip package for DRAM with two underfill materials
#75SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
#76Stacked semiconductor package
#77Semiconductor device including a lead frame
#78Semiconductor device and manufacturing method thereof
#79ELECTRICAL MODULE
#80Electronic apparatus manufacturing method
#81Electrical joint structure
#82Systems and methods for flash stacking
#83Method for polymer-assisted chip transfer
#84Simultaneous controlled depth hot embossing and active side protection during packaging and assembly of wide bandgap devices