209962 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Manufacturing methods Mechanical processes
Sub-classes:POWER STAGE DEVICE CLIP
#2SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
#4SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
#5METHOD AND APPARATUS FOR MANUFACTURING A TERMINAL APPARATUS FOR CONNECTING AT LEAST ONE ELECTRICAL OR ELECTRONIC COMPONENT FOR AN ELECTRICAL OR ELECTRONIC MODULE
#6SEMICONDUCTOR APPARATUS AND VEHICLE
#7Electrical connection member, electrical connection structure, and method for manufacturing electrical connection member
#8Interconnect Clip with Angled Contact Surface and Raised Bridge Technical Field
#9CLIPS FOR SEMICONDUCTOR PACKAGES
#10Semiconductor device
#11Package with vertical interconnect between carrier and clip
#12Electrode terminal, semiconductor device, and power conversion apparatus
#13Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#14Packaging solutions for devices and systems comprising lateral GaN power transistors
#15Semiconductor module
#16Semiconductor module
#17Semiconductor module
#18Lead for connection to a semiconductor device
#19Semiconductor module
#20Semiconductor module and method for manufacturing the same
#21Multichip power semiconductor device
#22Method for making contact with a semiconductor and contact arrangement for a semiconductor
#23Multichip power semiconductor device
#24Semiconductor device using diffusion soldering