H01L2224/3583 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the connector Reworking

• H01L2224/35831 » with a chemical process, e.g. with etching of the connector 1
• H01L2224/35847 » with a mechanical process, e.g. with flattening of the connector 9