209981 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Manufacturing methods; Post-treatment of the connector Thermal treatments, e.g. annealing, controlled cooling
SEMICONDUCTOR DIE PACKAGE
#2Additive manufacturing of a frontside or backside interconnect of a semiconductor die
#3Damaging components with defective electrical couplings
#4Damaging components with defective electrical couplings