H01L2224/37 - CPC Classification Index

ClassID:

209985 ⎘

H01L2224/37 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector

Sub-classes:

H01L2224/37001 » Core members of the connector 0
H01L2224/3754 » Coating 53

Recent Application in this class:

20240355773

2024-10-24

SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE

20220115307

2022-04-14

Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate

20190189545

2019-06-20

Electronic device

20120104621

2012-05-03

Power package module with low and high power chips and method for fabricating the same