209992 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector Coating
Sub-classes:Semiconductor device
#2Light emitting apparatus, illumination apparatus and display apparatus
#3Semiconductor device
#4Semiconductor package structure
#5Semiconductor device
#6Power module
#7Light emitting apparatus, illumination apparatus and display apparatus
#8Laser welding method
#9Stack die package
#10Semiconductor device
#11Semiconductor device
#12Vertical MOSFET device
#13Light emitting apparatus, illumination apparatus and display apparatus
#14Semiconductor package and method for fabricating the same
#15Clip interconnect with encapsulation material locking feature
#16LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD
#17NO LEAD PACKAGE WITH HEAT SPREADER
#18PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#19Vertical MOSFET with through-body via for gate
#20Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#21Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#22High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
#23Semiconductor device and method for fabricating the same
#24Semiconductor device and manufacturing method thereof
#25Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same
#26Semiconductor chip package
#27PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES
#28Thermally enhanced thin semiconductor package
#29Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer
#30Vertical MOSFET with through-body via for gate
#31Electronic package having down-set leads and method
#32Method of manufacturing electronic device on leadframe
#33High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
#34THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE
#35Semiconductor device
#36Semiconductor package structure having enhanced thermal dissipation characteristics
#37Semiconductor Package and Method for Fabricating the Same
#38Low temperature bonding material comprising metal particles and bonding method
#39Semiconductor device with lead frame including conductor plates arranged three-dimensionally
#40Semiconductor component comprising a semiconductor chip and semiconductor component carrier with external connection strips
#41Power semiconductor module
#42BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#43SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS
#44METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#45Chip-scale package
#46No lead package with heat spreader
#47Semiconductor device and method for manufacturing thereof
#48Semiconductor component and method of manufacture
#49Method for mounting an electronic part on a substrate using a liquid containing metal particles
#50Semiconductor device and manufacturing method thereof
#51Semiconductor chip, electrically connections therefor
#52Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
#53Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof