209987 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector; Core members of the connector Structure
SEMICONDUCTOR DEVICE HAVING A WIRING MEMBER WITH AN UNEVEN BONDING SURFACE
#2CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#3LEADFRAME AND ELECTRONIC DEVICE SINGULATION PROCESS
#4METAL CONNECTOR IN SEMICONDUCTOR DEVICE PACKAGE
#5Engineered Interconnect Structures for Enhanced Bonding Strength
#6CLIP
#7METALLIZATIONS FOR SEMICONDUCTOR POWER DEVICES
#8POWER MODULE AND POWER CONVERSION APPARATUS
#9PACKAGE WITH CLIP DIRECTLY CONNECTED TO OBLONG ELECTRIC CONNECTION ELEMENT EXTENDING ALONG MOUNTING BASE
#10METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE ASSEMBLY AS WELL AS A SEMICONDUCTOR PACKAGE ASSEMBLY OBTAINED WITH THIS METHOD
#11CARRIER WITH EMBEDDED ELECTRICAL CONNECTION, COMPONENT AND METHOD FOR PRODUCING A CARRIER
#12CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, AND ELECTRONIC DEVICE
#13SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND POWER CONVERSION DEVICE
#14METAL CLIP ASSEMBLY, SEMICONDUCTOR DEVICE ASSEMBLY, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLY, AND APPLICATION OF SEMICONDUCTOR DEVICE ASSEMBLY
#15SEMICONDUCTOR DEVICE
#16SEMICONDUCTOR MODULE
#17SEMICONDUCTOR DEVICE
#18Power substrate assembly with reduced warpage
#19MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
#20Current shunt with reduced temperature relative to voltage drop
#21SEMICONDUCTOR DEVICE
#22SEMICONDUCTOR DIE PACKAGE
#23SEMICONDUCTOR PACKAGE WITH IMPROVED CONNECTION OF THE PINS TO THE BOND PADS OF THE SEMICONDUCTOR DIE
#24Semiconductor device having a metal clip with a solder volume balancing reservoir
#25SEMICONDUCTOR DEVICE
#26High voltage semiconductor package with pin fit leads
#27CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#28Semiconductor device and production method for semiconductor device
#29Metal clip with solder volume balancing reservoir
#30CLIP INTERCONNECT WITH MICRO CONTACT HEADS
#31Wiring structure and semiconductor module
#32Additive manufacturing of a frontside or backside interconnect of a semiconductor die
#33Electronic module
#34Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#35Power module and method of manufacturing power module
#36Semiconductor module package and method of manufacturing the same
#37Semiconductor device and method of manufacturing the same
#38Double-sided chip stack assembly