210002 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector Structure
STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
#2CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#3SEMICONDUCTOR PACKAGE AND RELATED METHODS
#4CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
#5POWER STAGE DEVICE CLIP
#6METAL TAB FOR POWER SEMICONDUCTOR MODULE
#7STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM
#8ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE
#9SEMICONDUCTOR PACKAGE AND RELATED METHODS
#10SEMICONDUCTOR DEVICE
#11SEMICONDUCTOR MODULE
#12Clip design and method of controlling clip position
#13Power semiconductor module with laser-welded leadframe
#14CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#15Semiconductor device with sense terminal
#16Semiconductor device
#17CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#18Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
#19SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
#20CLIP INTERCONNECT WITH MICRO CONTACT HEADS
#21Clips for semiconductor packages
#22Semiconductor package and related methods
#23Integrated circuit connection arrangement for minimizing crosstalk
#24Integrated circuit connection arrangement for minimizing crosstalk
#25Connection arrangements for integrated lateral diffusion field effect transistors
#26Leadframe and integrated circuit connection arrangement
#27Semiconductor module
#28Conductor strip with contact areas having cutouts
#29Die-packaging component with retaining structure for package body thereof