210001 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
Sub-classes:POWER SEMICONDUCTOR DEVICE
#2Semiconductor device and fabrication method of the semiconductor device
#3Semiconductor device including resin with a filler for encapsulating bridge member connected to a substrate
#4Semiconductor device and fabrication method of the semiconductor device
#5Semiconductor device and fabrication method of the semiconductor device
#6Electric power conversion apparatus
#7Semiconductor device
#8Semiconductor device
#9Electronic device
#10Semiconductor device and fabrication method of the semiconductor device
#11Power module for an electric motor
#12Semiconductor device
#13Semiconductor package structure
#14Power module
#15Semiconductor device with stacked terminals
#16Control device with semiconductor module having bent latch, control, power supply and motor control terminals
#17Photovoltaic junction box providing quick heat dissipation
#18Semiconductor device
#19Electronic part mounting heat-dissipating substrate
#20Electric power conversion apparatus
#21High frequency semiconductor amplifier
#22Semiconductor module that have multiple paths for heat dissipation
#23Semiconductor component and method of manufacture
#24Semiconductor component having group III nitride semiconductor device mounted on substrate and interconnected to lead frame
#25Resistor and method for manufacturing resistor
#26Semiconductor device including conductive clip with flexible leads and related methods
#27Multiple die layout for facilitating the combining of an individual die into a single die
#28Magnetic field current sensors
#29Semiconductor Device with Circuit for Reduced Parasitic Inductance
#30Electric power conversion apparatus
#31Multiple die layout for facilitating the combining of an individual die into a single die
#32Power semiconductor device and method for its production
#33Semiconductor device with circuit for reduced parasitic inductance
#34Electric power conversion apparatus
#35Multi-chip module
#36Method and arrangement for contact-connecting semiconductor chips on a metallic substrate
#37Power semiconductor device connected in distinct layers of plastic
#38Semiconductor device with reduced parasitic inductance
#39Semiconductor device module structure
#40Semiconductor device
#41Generator-motor
#42Generator-motor