210003 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector Shape
Sub-classes:SEMICONDUCTOR DEVICE
#2LONG-LIFE EXTENDED TEMPERATURE RANGE EMBEDDED DIODE DESIGN FOR ELECTROSTATIC CHUCK WITH MULTIPLEXED HEATERS ARRAY
#3DUAL SWITCHING POWER DEVICE
#4SEMICONDUCTOR DEVICE
#5SEMICONDUCTOR MODULE
#6SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
#7SEMICONDUCTOR DEVICE
#8SEMICONDUCTOR DEVICE
#9SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#10SEMICONDUCTOR DEVICE
#11Long-life extended temperature range embedded diode design for electrostatic chuck with multiplexed heaters array
#12POWER ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME
#13SEMICONDUCTOR PACKAGE AND METHOD FOR MARKING A SEMICONDUCTOR PACKAGE
#14Power semiconductor module with laser-welded leadframe
#15CLIP INTERCONNECT WITH MICRO CONTACT HEADS
#16Plurality of leads between MOSFET chips
#17Long-life extended temperature range embedded diode design for electrostatic chuck with multiplexed heaters array
#18Semiconductor package having a lead frame including die paddles and method of making the same
#19Semiconductor device
#20CLIPS FOR SEMICONDUCTOR PACKAGES
#21Semiconductor package including low side field-effect transistors and high side field-effect transistors and method of making the same
#22Electronic component
#23Electronic module, method of manufacturing connector, and method of manufacturing electronic module
#24Semiconductor module with temperature detecting element
#25Power device and preparation method thereof
#26Carrier and clip each having sinterable, solidified paste for connection to a semiconductor element, corresponding sintering paste, and corresponding production method and use
#27Electric power semiconductor device
#28Molding material and method for packaging semiconductor chips
#29Module including a discrete device mounted on a DCB substrate
#30Thermally efficient integrated circuit package