H01L2224/404 - CPC Classification Index

ClassID:

210012 ⎘

H01L2224/404 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto; Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector Connecting portions

Sub-classes:

H01L2224/4046 » with multiple bonds on the same bonding area 3
H01L2224/40475 » connected to auxiliary connecting means on the bonding areas 29

Recent Application in this class:

20250343198

SEMICONDUCTOR DEVICE HAVING A WIRING MEMBER WITH AN UNEVEN BONDING SURFACE

20250336750

SEMICONDUCTOR PACKAGE

20250132282

CONTACT DEVICE AND POWER MODULE ARRANGEMENT

20250079414

ELECTRONIC PACKAGE MODULE AND METHOD FOR FABRICATION OF THE SAME

20240395761

METAL CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

20240153904

SEMICONDUCTOR MODULE

20240128166

SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE

20230299036

SEMICONDUCTOR DEVICE

20220359452

Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor package

20210183807

Electronic module

20210175198

Electronic module

20210175197

Method of manufacturing chip module

20200273833

Electronic module, method of manufacturing connector, and method of manufacturing electronic module