Through-hole via on saw streets

Method of manufacturing an integrated circuit

Circuit device including rotated stacked die

Low voltage drop and high thermal performance ball grid array package

SEMICONDUCTOR DEVICE

3-D stacking of active devices over passive devices

ULTRA-THIN CHIP PACKAGING

INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device with a peripheral circuit formed therein

Externally configurable integrated circuits

Circuit board and manufacturing method thereof

Hidden plating traces

Thinned image sensor with trench-insulated contact terminals

Semiconductor package with mechanical stress isolation of semiconductor die subassembly

Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element

Chip package

Semiconductor device and method of forming vertical interconnect structure using stud bumps

SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

Chip mounting device and chip package array

Wafer level integration package

Inline integrated circuit system

Power converter apparatus

Integrated circuit package-on-package system with central bond wires

Apparatus and method for a chip assembly including a frequency extending device

Semiconductor device and programming method

Semiconductor device packages with electromagnetic interference shielding

Power conversion apparatus

Microwave Cure of Semiconductor Devices

Multi-chip stack package

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Electronic component and method for its production

Semiconductor package using an active type heat-spreading element

LEADFRAME-BASED IC-PACKAGE WITH SUPPLY-REFERENCE COMB

Multilayer wiring substrate, semiconductor package, and method of manufacturing semiconductor package

Semiconductor device

Leadframe for packaged electronic device with enhanced mold locking capability

Z-AXIS MOTION SYSTEM FOR A WIRE BONDING MACHINE

METHOD OF PRODUCING SEMICONDUCTOR PACKAGES

Integrated circuit tampering protection and reverse engineering prevention coatings and methods

Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring

Circuit device

Mounting structure of semiconductor device and electronic apparatus using thereof

Power Device Substrates and Power Device Packages Including the Same

Flat magnetic element and power IC package using the same

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Methods to Form a Three-Dimensionally Curved Pad in a Substrate and Integrated Circuits Incorporating such a Substrate

Window type BGA semiconductor package and its substrate

Enhanced thermal dissipation ball grid array package

Semiconductor device package

Mounting structure of semiconductor device and electronic apparatus using same

Integrated circuit package system with stacking module

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH NON-SYMMETRICAL SUPPORT STRUCTURES

Mountable integrated circuit package system with substrate

Semiconductor device and method for manufacturing semiconductor device

Lead frame and package of semiconductor device

Leadframe, semiconductor packaging structure and manufacturing method thereof

Structure for reduction of soft error rates in integrated circuits

Method of manufacturing semiconductor device and semiconductor device

Capacitive isolation circuitry with improved common mode detector

Semiconductor device capable of switching operation modes

IC PACKAGING PROCESS

METHOD OF STACKING DIES FOR DIE STACK PACKAGE

Method for manufacturing microelectronic devices

Method and jig structure for positioning bare dice

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Devices and system for electrostatic discharge suppression

High frequency power amplifier

Chip package structure

Integrated circuit package system with stacking module

Integrated circuit package system for stackable devices

Package-on-package system with via Z-interconnections

Integrated circuit package system with support structure for die overhang

Semiconductor package having substrate ID code and its fabricating method

RF transistor output impedance technique for improved efficiency, output power, and bandwidth

Semiconductor device packages and assemblies

Ball grid array package system

THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Integrated circuit packaging system with package-in-package and method of manufacture thereof

Integrated circuit package system with step mold recess

COL SEMICONDUCTOR PACKAGE

Semiconductor chip package

Semiconductor package having a bridged plate interconnection

Semiconductor chip package

Apparatus and method for series connection of two die or chips in single electronics package

Integrated circuit package system with isloated leads

Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement

Thin quad flat package with no leads (QFN) fabrication methods

Electric power conversion apparatus

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor package and multi-chip package using the same

Semiconductor package structure with heat sink

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

System for solder ball inner stacking module connection

Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF

Semiconductor package having a cavity structure

Method for producing a semiconductor device and the semiconductor device

Stress Mitigation in Packaged Microchips

Leadframe package with dual lead configurations

Semiconductor Device

Semiconductor die package including IC driver and bridge

Integrated circuit package system with integration port

Solid-state imaging device and method of fabricating solid-state imaging device

Housing body and method for production thereof

NON-PLANAR SUBSTRATE STRIP AND SEMICONDUCTOR PACKAGING METHOD UTILIZING THE SUBSTRATE STRIP

SEMICONDUCTOR DEVICE

Method of fabricating semiconductor components with through interconnects

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor module molded by resin with heat radiation plate opened outside from mold

Substrate and semiconductor package for lessening warpage

Solid-state image sensing apparatus and package of same

Semiconductor device and fabricating method thereof

Wafer level die integration and method therefor

Integrated circuit with step molded inner stacking module package in package system

Semiconductor package with mold lock vent

Semiconductor device with wire-bonding on multi-zigzag fingers

Semiconductor package with stacked semiconductor die each having IPD and method of reducing mutual inductive coupling by providing selectable vertical and lateral separation between IPD

Semiconductor device having a gate contact on one surface electrically connected to a gate bus on an opposing surface

Light emitting diode package structure and manufacturing method therefor

Lead frame isolation using laser technology

Apparatus and methods for forming wire bonds

Method of a package on package packaging

Electrochemical cell and fabrication method of the same

Miniature optical element for wireless bonding in an electronic instrument

Power electronics assembly with cooling element

LED linear light source and devices using such source

SEMICONDUCTOR CHIP

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Storage medium and semiconductor package

Lead frame based semiconductor package and a method of manufacturing the same

Semiconductor device, electronic device, and manufacturing method of the same

WIRE BONDER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Package having exposed integrated circuit device

Manufacturing method of resin-sealed semiconductor device

Board on chip package and method of manufacturing the same

Capacitive isolation circuitry

Power module

Integrated circuit nanotube-based subsrate

Electrical module

Semiconductor device

Semiconductor devices having a resin with warpage compensated surfaces

Semiconductor device and a method of manufacturing the same

Routing structure of re-distribution layer and method for re-distributing routing structure in integrated circuit

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Semiconductor device

Integrated circuit package system with external interconnects within a die platform

Ball grid array package layout supporting many voltage splits and flexible split locations

SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING

Resin sealed semiconductor device and manufacturing method therefor

Leadframe having mold lock vent

Package system for shielding semiconductor dies from electromagnetic interference

Optical leadless leadframe package

Method for forming lead frame land grid array

Chipstack package and manufacturing method thereof

Method of manufacturing semiconductor package

High voltage isolation dual capacitor communication system

RF module

Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate

STACKING OF TRANSFER CARRIERS WITH APERTURE ARRAYS AS INTERCONNECTION JOINTS

System and method for integrated waveguide packaging

Board on chip package and manufacturing method thereof

SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING A WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME

Semiconductor device having chip mounted on an interposer

Integrated circuit and method

Intermediate Bond Pad for Stacked Semiconductor Chip Package

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

SEMICONDUCTOR DEVICE FABRICATING METHOD

Semiconductor package, and method of manufacturing semiconductor package

INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE

Integrated circuit having wide power lines

Semiconductor device and method of manufacturing the same

3D smart power module

Semiconductor device and manufacturing method therefor

Lead Frame Fabrication Method

Method of fabricating chip package structure

Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections

Apparatus and methods for packaging integrated circuit chips with antennas formed from package lead wires

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Integrated Circuit and Memory Module

Power semiconductor module including a contact element

Hybrid carrier and a method for making the same

Folded leadframe multiple die package

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

Wire bonding method

SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS

Bondwire design

Microelectronic devices and methods for forming interconnects in microelectronic devices

Method for singulating semiconductor devices

Apparatus for improved power distribution in wirebond semiconductor packages

Semiconductor device

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

High temperature operating package and circuit design

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Integrated circuit package system with wafer scale heat slug

Tape wiring substrate and tape package using the same

Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same

Printed circuit board, semiconductor package, card apparatus, and system

Manufacturing process and structure for embedded semiconductor device

Electronic Circuit Package

Semiconductor package with stacked dice for a buck converter

Method of manufacturing electronic device on leadframe

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Method for manufacturing electronic device

IC PACKAGING PROCESS BY PHOTO-CURING ADHESIVE

Semiconductor package with an antenna and manufacture method thereof

Semiconductor power device with bias circuit

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor package apparatus having redistribution layer

Semiconductor package having insulated metal substrate and method of fabricating the same

Electromagnetic shilding structure and manufacture method for multi-chip package module

Method for fabricating a flip chip system in package

SEMICONDUCTOR DEVICE PACKAGE

Integrated circuit package and fabricating method thereof

Local area semiconductor cooling system

Stacked semiconductor package assembly having hollowed substrate

Semiconductor device and method of manufacturing the same

Semiconductor device, DC/DC converter and power supply

Method of manufacturing a semiconductor device

Method for forming a die-attach layer during semiconductor packaging processes

Interposer and method for manufacturing interposer

High power integrated RF amplifier

Combination substrate

Semiconductor device and the method of manufacturing the same

SEMICONDUCTOR SYSTEM HAVING BGA PACKAGE WITH RADIALLY BALL-DEPOPULATED SUBSTRATE ZONES AND BOARD WITH RADIAL VIA ZONES

Integrated circuit package system with heat slug

CIRCUIT BOARD, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF CIRCUIT BOARD

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Semiconductor device and programming method

Module with Flat Construction and Method for Placing Components

Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

Semiconductor package and semiconductor device

Silicon heat spreader mounted in-plane with a heat source and method therefor

Semiconductor package with an embedded printed circuit board and stacked die

Multi-chip package

ESD protection semiconductor device having an insulated-gate field-effect transistor

Circuit board ready to slot

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Optimized circuit design layout for high performance ball grid array packages

Integrated circuit device and method of producing

Compact inductive power electronics package

CIRCUIT BOARD FOR SEMICONDUCTOR PACKAGE HAVING A REDUCED THICKNESS, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Method for cutting and molding in small windows to fabricate semiconductor packages

Integrated circuit package with improved connections

Power semiconductor module

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

SEMICONDUCTOR CHIP PACKAGE

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

Stack combination of plural chip package units

Integrated circuit package system with interposer

Etched surface mount islands in a leadframe package

LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES

System and apparatus for wafer level integration of components

Leadframe design for QFN package with top terminal leads

Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility

Semiconductor chip

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Low profile wire bonded USB device

Method of forming a wafer level package

Semiconductor device

Electronic circuit arrangement and method for producing an electronic circuit arrangement

Compact power semiconductor package and method with stacked inductor and integrated circuit die

Formation of a hybrid integrated circuit device

Semiconductor element, semiconductor device, and fabrication method thereof

Reconstituted wafer level stacking

Managed Memory Component

Semiconductor package with leads on a chip having multi-row of bonding pads

Package with multiple dies

ISOLATOR AND METHOD OF MANUFACTURING THE SAME

Infrared proximity sensor package with reduced crosstalk

Integrated circuits with phase change devices

Low cost high frequency device package and methods

Integrated circuit package system with package integration

Semiconductor device and method of forming integrated passive device module

Multi-die wafer level packaging

Thermal mechanical flip chip die bonding

Semiconductor device and optical pickup device

Circuit board having bypass pad

Method of forming stacked die package

SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Methods and systems for packaging integrated circuits

Integrated circuit packaging system with interposer

Leadframe having die attach pad with delamination and crack-arresting features

Integrated circuit package system for shielding electromagnetic interference

Method of opening pad in semiconductor device

Electronic device including an inductor

Semiconductor apparatus

Semiconductor component

Integrated circuit packaging system with leadframe interposer and method of manufacture thereof

Disguising test pads in a semiconductor package

WIRE BONDING METHOD

Semiconductor device and touch sensor device

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE