Stacking integrated circuits containing serializer and deserializer blocks using through silicon via

Method of encapsulating wire bonds

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Multi-chip module and methods

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Inverter power module with distributed support for direct substrate cooling

Isolator with complementary configurable memory

SEMICONDUCTOR DEVICE

STACKED TYPE CHIP PACKAGE STRUCTURE

MICROFEATURE WORKPIECE SUBSTRATES HAVING THROUGH-SUBSTRATE VIAS, AND ASSOCIATED METHODS OF FORMATION

CHIP SCALE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Ball grid array package having one or more stiffeners

Semiconductor package fabrication method

Semiconductor package and method therefor

Semiconductor device and method for fabricating semiconductor device

QFN package

Package structure utilizing high and low side drivers on separate dice

Semiconductor device and method of forming the device using sacrificial carrier

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

WIRE BODNING PACKAGE STRUCTURE

Stackable multi-chip package system with support structure

STACKED-CHIP DEVICE

Vias and method of making

Stacked-chip device

Package, method of manufacturing a package and frame

Integrated circuit apparatus, systems, and methods

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Thin foil semiconductor package

Circuit for detecting bonding defect in multi-bonding wire

Semiconductor device having pairs of pads

Integrated circuit package system having cavity

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stacked integrated circuit package-in-package system and method of manufacture thereof

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Lead frame, resin package, semiconductor device and resin package manufacturing method

Heat dissipating package structure and method for fabricating the same

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Three dimensional nanoscale circuit interconnect and method of assembly by dielectrophoresis

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

Bond pad for wafer and package for CMOS imager

Integrated circuit package with open substrate

Semiconductor package and method for manufacturing the same

Leadless package with internally extended package leads

Semiconductor module with two cooling surfaces and method

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Method for fabricating package structure of stacked chips

Exposed interconnect for a package on package system

Method for forming a package-on-package structure

Semiconductor device with an improved solder joint

Semiconductor assembly with component pads attached on die back side

CHIP PACKAGE STRUCTURE

Stacked Memory Module

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same

Semiconductor device packages with electromagnetic interference shielding

Destructor integrated circuit chip, interposer electronic device and methods

Semiconductor device and radio communication device

Semiconductor device and method for making the same

Large area thin freestanding nitride layers and their use as circuit layers

NONVOLATILE MEMORY SYSTEM

DICING DIE-BONDING FILM

Dicing die-bonding film

DICING DIE-BONDING FILM

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

DICING DIE-BONDING FILM

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Microelectronic packages with small footprints and associated methods of manufacturing

SEMICONDUCTOR INTEGRATED CIRCUIT HAVING HEAT RELEASE PATTERN

Antennas integrated in semiconductor chips

SHIELDED WIREBOND

Embedded inductor and method of producing thereof

Leadframe, semiconductor device, and method of manufacturing the same

Integrated circuit package stacking system

Fan-in interposer on lead frame for an integrated circuit package on package system

RDL patterning with package on package system

Method for forming an etched recess package on package system

Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame

METHOD OF FORMING ON-CHIP PASSIVE ELEMENT

Method of manufacturing a stacked semiconductor apparatus

RF shielding arrangement for semiconductor packages

Method of manufacturing a wafer including providing electrical conductors isolated from circuitry

Method and apparatus for improvements in chip manufacture and design

Semiconductor device including a transformer on chip

Semiconductor device and method for manufacturing the same

Semiconductor module and a method for producing an electronic circuit

High frequency ceramic package and fabrication method for the same

BALL GRID ARRAY PACKAGE

UNIVERSAL SUBSTRATE FOR SEMICONDUCTOR PACKAGES AND THE PACKAGES

Integrated circuit package system with leadframe substrate

Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages

Method of forming a molded array package device having an exposed tab and structure

DICING/DIE BONDING FILM

Semiconductor system-in-package and method for making the same

Multi lead frame power package

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

IC HAVING FLIP CHIP PASSIVE ELEMENT AND DESIGN STRUCTURE

STACK TYPE SEMICONDUCTOR CHIP PACKAGE HAVING DIFFERENT TYPE OF CHIPS AND FABRICATION METHOD THEREOF

Semiconductor device and semiconductor package including the same

Holding jig for electronic parts

Pop semiconductor device manufacturing method

Semiconductor module and method

FINE PITCH BOND PAD STRUCTURE

Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via

Semiconductor device, production method for the same, and substrate

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies

Stress Mitigation in Packaged Microchips

Stackable molded packages and methods of making the same

Semiconductor device packages with electromagnetic interference shielding

OPTICAL SEMICONDUCTOR DEVICE

Radio frequency unit analog level detector and feedback control system

Semiconductor device

Lens support and wirebond protector

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Integrated connection arrangements

Semiconductor device and a method of manufacturing the same

Semiconductor device and method of forming composite bump-on-lead interconnection

INTEGRATED CIRCUIT DEVICE WITH IMPROVED UNDERFILL COVERAGE

Semiconductor device

Multi-layer semiconductor package with vertical connectors and method of manufacture thereof

Semiconductor package structure and method for manufacturing the same

Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier

Embedded semiconductor die package and method of making the same using metal frame carrier

Integrated circuit package system with chip on lead

Fine-pitch routing in a lead frame based system-in-package (SIP) device

Packaging integrated circuits for high stress environments

INTEGRATED CIRCUIT PACKAGE WITH EMI SHIELD

Optical signaling for a package-on-package stack

System-in-package module and mobile terminal having the same

Package substrate structure

Radio frequency (RF) integrated circuit (IC) packages having characteristics suitable for mass production

Semiconductor device with fuse portion

SYSTEM IN PACKAGE MODULE

PACKAGE STRUCTURE FOR RADIO FREQUENCY MODULE AND MANUFACTURING METHOD THEREOF

Integrated circuit package system with bumped lead and nonbumped lead

Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation

Manufacturing method for integrating a shunt resistor into a semiconductor package

Integrated circuit package, notably for image sensor, and method of positioning

Circuit substrate and method of fabricating the same and chip package structure

Lead-embedded metallized ceramics substrate and package

Printed circuit board assembly

Method of manufacturing layered chip package

Laser optical path detection in integrated circuit packaging

Non-destructive laser optical integrated circuit package marking

Semiconductor package with reduced inductive coupling between adjacent bondwire arrays

Transistor and routing layout for a radio frequency integrated CMOS power amplifier device

Semiconductor memory device

Layered chip package and method of manufacturing same

WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Integrated circuit package system with locking terminal

Semiconductor package and manufacturing method thereof

Semiconductor device and semiconductor integrated circuit

Integrated circuit package system stackable devices

Integrated circuit package system with conformal shielding and method of manufacture thereof

SYSTEM WITH RADIO FREQUENCY INTEGRATED CIRCUITS

Fabrication of compact opto-electronic component packages

METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE

Arrangement for energy conditioning

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Semiconductor package with heat sink, stack package using the same and manufacturing method thereof

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Semiconductor device

Magnetic field sensor arrangement and method for non-contact measurement of a magnetic field

Layered chip package and method of manufacturing same

Electrode structure and semiconductor device

Semiconductor device

Stacked semiconductor devices and a method for fabricating the same

Die attach method and leadframe structure

PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION

Method of controlling the trajectory of a bonding tool during the formation of a wire loop

Semiconductor package and manufacturing method thereof

Circuit apparatus and method of manufacturing the same

Return loss techniques in wirebond packages for high-speed data communications

Semiconductor device and method of manufacturing the same

Semiconductor module and method for fabricating semiconductor module

Method of forming stress relief layer between die and interconnect structure

Compliant wirebond pedestal

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit package system with die and package combination

Semiconductor chip package and multichip package

Ball grid array package stacking system

LEAD FRAME, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING LEAD FRAME AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Body to be plated, method of determining plated film thickness, and method of manufacturing semiconductor device

CHIP PACKAGE FOR SEMICONDUCTOR DEVICES

Integrated circuit package system with internal stacking module

Inductor module, silicon tuner module and semiconductor device

VERTICAL TRANSISTOR WITH INTEGRATED ISOLATION

Wire bonding method

WIRE FEED SYSTEM AND METHOD OF OPERATING THE SAME

Method of manufacturing semiconductor package with etch removal of carrier frame and base plating layer

Method of making foil based semiconductor package

Integrated circuit package system for stackable devices

Laminate substrate and semiconductor package utilizing the substrate

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

STACKED DIE PACKAGE

Semiconductor device and method of forming recessed conductive vias in saw streets

Semiconductor device having function circuits selectively connected to bonding wire

Semiconductor package fabricated by cutting and molding in small windows

Method and apparatus for thermally enhanced semiconductor package

Resin sealed semiconductor device and manufacturing method therefor

Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package

Integrated circuit packaging system with isolated pads and method of manufacture thereof

COL (Chip-On-Lead) multi-chip package

Semiconductor device having electrical devices mounted to IPD structure and method for shielding electromagnetic interference

Semiconductor device and method of connecting a shielding layer to ground through conductive vias

Semiconductor device and method of forming shielding layer grounded through metal pillars formed in peripheral region of the semiconductor

Semiconductor device and method of shielding semiconductor die from inter-device interference

Electrically conducting connection with insulating connection medium

Low resistance integrated MOS structure

Light emitting device

Method of forming a leaded molded array package

CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF

Package for a Die

SEMICONDUCTOR DEVICE

Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package

Cooling fin and package substrate comprising the cooling fin and manufacturing method thereof

Semiconductor device and manufacturing method therefor

Semiconductor device assembly and method thereof

Stacked structure of integrated circuits having space elements

Package-on-package system with heat spreader

LEAD FRAME AND SEMICONDUCTOR DEVICE UTILIZING THE SAME

TWO-WAY HEAT EXTRACTION FROM PACKAGED SEMICONDUCTOR CHIPS

Semiconductor package system with cut multiple lead pads

Conductive clip for semiconductor device package

Leadframe having delamination resistant die pad

Methods of making an electronic component package and semiconductor chip packages

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming double-sided through vias in saw streets

CARD TYPE MEMORY PACKAGE

Circuit board process

Method of manufacturing a semiconductor device and molding die

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor device and a semiconductor device manufacturing method

Semiconductor device and method of manufacturing a semiconductor device

SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE USING THE SAME

HERMETIC SEALING OF MICRO DEVICES

Circuit board, lead frame, semiconductor device, and method for fabricating the same

Structure and manufacturing method of chip scale package

Semiconductor package having an antenna on the molding compound thereof

Semiconductor package and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Integrated circuit package system with shield and tie bar

Power semiconductor device

Electronic device and method of manufacturing the same

Semiconductor package with a chip on a support plate

Silver-coated ball and method for manufacturing same

Method for manufacturing printed wiring board

Integrated circuit package having integrated faraday shield

SEMICONDUCTOR PACKAGE, MOUNTING CIRCUIT BOARD, AND MOUNTING STRUCTURE

Thermally Enhanced Package with Embedded Metal Slug and Patterned Circuitry

Semiconductor chip package structure

Semiconductor device

Semiconductor package, method for manufacturing a semiconductor package, an electronic device, method for manufacturing an electronic device

Package structure and method

Semiconductor multi-package module including tape substrate land grid array package stacked over ball grid array package

INTEGRATED CIRCUIT PACKAGE SYSTEM

OPTICAL SEMICONDUCTOR DEVICE

Semiconductor chip package assembly with deflection- resistant leadfingers

Semiconductor device and method

Lead-on-chip semiconductor package and leadframe for the package

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

Multilayered lead frame for a semiconductor light-emitting device

Apparatus and system for miniature surface mount devices

Method of fabricating chip package

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Device and method for limiting drain-source voltage of transformer-coupled push pull power conversion circuit

Module

Multi-chip package including component supporting die overhang and system including same

Semiconductor package having stepwise depression in substrate

Semi-finished package and method for making a package

Bonding pad sharing method applied to multi-chip module and apparatus thereof

IC device having low resistance TSV comprising ground connection

STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

Stacked type chip package structure including a chip package and a chip that are stacked on a lead frame

Substrate for mounting electronic component and electronic apparatus including the substrate

Method for performing a shelf lifetime acceleration test

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Semiconductor integrated circuit

Enhanced architectural interconnect options enabled with flipped die on a multi-chip package

Semiconductor component with improved contact pad and method for forming the same

High density memory device manufacturing using isolated step pads

Integrated circuit package on package system

Bond wire loop for high speed noise isolation

Wire bonding to connect electrodes

Interposer chip and multi-chip package having the interposer chip

Athmosphere-Controlled Bonding Apparatus, Bonding Method, and Electronic Device

Method of forming an integrated circuit with MM-wave antennas using conventional IC packaging

Horn-holder pivot type bonding apparatus

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same