Laminated ceramic package

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Integrated circuit package-on-package stacking system and method of manufacture thereof

Fabrication method of semiconductor package

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Flip-chip leadframe semiconductor package

Lead frame and semiconductor device provided with lead frame

Electronic device

Integrated circuit package-in-package system housing a plurality of stacked and offset integrated circuits and method of manufacture therefor

Embedded package security tamper mesh

Integrated circuit package system with shield

Integrated circuit package system for electromagnetic isolation

Secure connector grid array package

Component attach methods and related device structures

Leaded stacked packages having elevated die paddle

Data transfer between chips in a multi-chip semiconductor device with an increased data transfer speed

LCD Driver IC and Method for Manufacturing the Same

System-in-package

Relay switch including an energy detection circuit

Wafer level package integration and method

Wafer level die integration and method

Multi-chip stack structure and method for fabricating the same

Semiconductor device and method of making integrated passive devices

COMBINATION SUBSTRATE

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor module with switching components and driver electronics

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Semiconductor device with less power supply noise

ASSEMBLING OF DOUBLED-SIDE STACKING PULRAL CHIPS

Electronic component with wire bonds in low modulus fill encapsulant

Method of producing multiple semiconductor devices

Integrated circuit packaging system with carrier and method of manufacture thereof

Semiconductor package and packaging method for balancing top and bottom mold flows from window

Semiconductor power device package having a lead frame-based integrated inductor

Leadframe based flash memory cards

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of making a connection component with posts and pads

Substrate based unmolded package

Stacked dual MOSFET package

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Power module and method of fabricating the same

Drop-mold conformable material as an encapsulation for an integrated circuit package system

Semiconductor module

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

SURFACE MOUNT PACKAGE WITH ENHANCED STRENGTH SOLDER JOINT

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

PACKAGE-ON-PACKAGE WITH IMPROVED JOINT RELIABILITY

POP (package-on-package) semiconductor device

Integrated circuit package system with insulator over circuitry

CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package-in-package system with wire-in-film encapsulant

POP (package-on-package) device encapsulating soldered joints between external leads

Semiconductor chip device having through-silicon-via (TSV) and its fabrication method

Electrical device and method

Apparatus and method for producing a bonding connection

Substrate for mounting electronic part and electronic part

MANUFACTURING METHOD OF LOW TEMPERATURE CO-FIRED CERAMICS SUBSTRATE

Integrated circuit with intra-chip clock interface and methods for use therewith

Imaging device and method for a bonding apparatus

Semiconductor chip and semiconductor device including the same

Semiconductor package and mounting method thereof

Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads

Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region

Stacked semiconductor package

Semiconductor chip package

Lead frame structure and applications thereof

Wire bond free wafer level LED

Method of forming an inductor on a semiconductor wafer

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of fabricating circuit board

METHOD FOR POWER SEMICONDUCTOR MODULE FABRICATION, ITS APPARATUS, POWER SEMICONDUCTOR MODULE AND ITS JUNCTION METHOD

Semiconductor Package Thermal Performance Enhancement and Method

Electronic Circuit Package

Semiconductor package

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Structures and methods for stack type semiconductor packaging

Mountable integrated circuit package system with mounting interconnects

Semiconductor package and semiconductor device

Integrated circuit package

Light source and method of controlling light spectrum of an LED light engine

Coated lead frame

High-Density Fine Line Structure And Method Of Manufacturing The Same

Packaged gallium nitride material transistors and methods associated with the same

Semiconductor device and method for adjusting characteristics thereof

Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus

Device with a plurality of semiconductor chips

Device including a semiconductor chip having a plurality of electrodes

Chip structure

CHIP PACKAGE STRUCTURE AND ITS FABRICATION METHOD

SEMICONDUCTOR PACKAGE

Semiconductor integrated circuit device, PDP driver, and plasma display panel

Mountable integrated circuit package system with substrate having a conductor-free recess

Semiconductor package

SEMICONDUCTOR DEVICE AND ITS FABRICATION PROCESS

Non-leaded semiconductor package structure

Direct-connect signaling system

Silicon substrate for package

Method of packaging an LED array module

PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME

Semiconductor chip with coil element over passivation layer

Stacked packaging improvements

Semiconductor package having increased resistance to electrostatic discharge

Power recovery circuit based on partial standing waves

Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device

Chip package structure and method of manufacturing the same

Semiconductor package and method for fabricating the same

Wafer level stacked die packaging

SEMICONDUCTOR DEVICE, LAYERED TYPE SEMICONDUCTOR DEVICE USING THE SAME, BASE SUBSTRATE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor package, module, system having solder ball coupled to chip pad and manufacturing method thereof

Packaged microchip with spacer for mitigating electrical leakage between components

Integrated circuit package

Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure

Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same

Package for a light emitting element

Electronic device

Method of forming premolded lead frame

Layout schemes and apparatus for high performance DC-DC output stage

Semiconductor package and method for fabricating the same

SOI on package hypersensitive sensor

Integrated circuit underfill package system

Semiconductor device and method of manufacturing the same

Connecting structure for connecting at least one semiconductor component to a power semiconductor module

Semiconductor device

Semiconductor package and substrate for the same

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Semiconductor apparatus with decoupling capacitor

Wiring board, semiconductor apparatus and method of manufacturing them

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for fabricating heat dissipating semiconductor package

Method of manufacturing semiconductor device

Die offset die to bonding

Die offset die to die bonding

Integrated circuit package system including die having relieved active region

Semiconductor package having marking layer

Stackable semiconductor package having plural pillars per pad

Semiconductor Device Package

Memory Packages Having Stair Step Interconnection Layers

Partitioned Integrated Circuit Package with Central Clock Driver

Stacked-type chip package structure and method of fabricating the same

STACKABLE INTEGRATED CIRCUIT PACKAGE

Semiconductor device

Integrated circuit package including miniature antenna

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

Audio power amplifier package

Die warpage control

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF

Semiconductor device with copper wirebond sites and methods of making same

Ball grid array substrate package and solder pad

Power semiconductor module

Semiconductor device

Integrated circuit packaging system with base structure device

METHOD AND APPARATUS FOR PACKAGE-TO-BOARD IMPEDANCE MATCHING FOR HIGH SPEED INTEGRATED CIRCUITS

Glass cap molding package, manufacturing method thereof and camera module

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Electronic device

Method of applying encapsulant to wire bonds

Wire bond encapsulant application control

Method of reducing wire bond profile height in integrated circuits mounted to circuit boards

Method of wire bond encapsulation profiling

Method for forming BGA package with increased standoff height

Integrated circuit support for low profile wire bond

MULTI-BAND TUNABLE RESONANT CIRCUIT

Multi-chip package for reducing parasitic load of pin

Integrated circuit package system with multiple device units

Stacked dual-die packages, methods of making, and systems incorporating said packages

Integrated circuit packaging system with interposer

Semiconductor device having decoupling capacitor formed on substrate where semiconductor chip is mounted

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Integrated circuit packaging system with passive components

Tape substrate and semiconductor module for smart card, method of fabricating the same, and smart card

Method of manufacturing integrated circuit package system with warp-free chip

Integrated circuit package system with under paddle leadfingers

Semiconductor package and manufacturing method thereof

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

SEMICONDUCTOR APPARATUS

Semiconductor device

Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards

Wirebonder forming low profile wire bonds between integrated circuits dies and printed circuit boards

Three dimensional packaging optimized for high frequency circuitry

Wafer level package with cavities for active devices

Manufacturing method of semiconductor device with a mold resin having a mold release agent

Thermally enhanced package structure

Carrier assembly for an integrated circuit

Package, packaging method and substrate thereof for sliding type thin fingerprint sensor

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

High voltage interlock system and control strategy

Semiconductor device, and manufacturing method of semiconductor device

Integrated circuit package system with delamination prevention structure

Integrated circuit package system with multi-chip module

Electric device, stack of electric devices, and method of manufacturing a stack of electric devices

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A STACKED INTEGRATED CIRCUIT PACKAGE

Integrated circuit package system with dual connectivity

Integrated circuit package system with leads separated from a die paddle

Integrated circuit package-in-package system with leads

Molded semiconductor device including IC-chip covered with conductor member

Three-Dimensional Memory-Based Three-Dimensional Memory Module

Electronic device having stack-type semiconductor package and method of forming the same

High density in-package microelectronic amplifier

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Chip module and a fabrication method thereof

Stack chip and stack chip package having the same

Package structure for multiple die stack

Structure of high performance combo chip and processing method

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor device package structure

Semiconductor package embedded in substrate, system including the same and associated methods

Semiconductor device with leadframe including a diffusion barrier

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Multilayer semiconductor device

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Semiconductor device and manufacturing method of the same

Imaging device and method for a bonding apparatus

Semiconductor apparatus

Semiconductor apparatus

Stack-type semiconductor package, method of forming the same and electronic system including the same

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

MULTIPLE CHIP SEMICONDUCTOR DEVICE

Method and structure for increased wire bond density in packages for semiconductor chips

Structure of high performance combo chip and processing method

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

Integrated Circuit Package with Passive Component

Semiconductor memory package

Method of manufacturing semiconductor device having plural dicing steps

APPARATUS TO SAW WAFER AND HAVING NOZZLE TO REMOVE BURRS IN SCRIBE LANES, METHOD OF SAWING WAFER, AND SEMICONDUCTOR PACKAGE FABRICATED BY THE SAME

Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposer

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Semiconductor device

METHOD OF MANUFACTURING A COMBINED MULTILAYER CIRCUIT BOARD HAVING EMBEDDED CHIPS

Semiconductor packaging method

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Multilayer ceramic substrate and method for producing same

Micro-power source module

Semiconductor device having a semiconductor chip mounted on an insulator film and coupled with a wiring layer, and method for manufacturing the same

CORNER I/O PAD DENSITY

Package structure and manufacturing method thereof

Package structure and manufacturing method thereof

Method of Manufacture and Identification of Semiconductor Chip Marked For Identification with Internal Marking Indicia and Protection Thereof by Non-black Layer and Device Produced Thereby

STACK PACKAGE AND METHOD OF FABRICATING THE SAME

LEAD FRAME STRUCTURE

Semiconductor chip stack-type package and method of fabricating the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Lead frame with non-conductive connective bar

Electronic component with buffer layer

Semiconductor device and printed circuit board

Semiconductor device

Planar magnetic device and power supply IC package using same

Multi-substrate region-based package and method for fabricating the same

Microelectronic package

Semiconductor package-on-package (POP) device avoiding crack at solder joints of micro contacts during package stacking

Multidirectional Semiconductor Device Package Thermal Enhancement Systems and Methods

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Power semiconductor device

Semiconductor circuit and switching power supply apparatus

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Near chip scale package integration process

Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

Semiconductor structure and semiconductor manufacturing method

Mounting assembly of semiconductor packages prevent soldering defects caused by substrate warpage

Leadframe-based semiconductor package

SEMICONDUCTOR DEVICE

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Heat slug and semiconductor package

Adhesive bleed prevention method and product produced from same

Power electronics devices with integrated gate drive circuitry

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

SEMICONDUCTOR DEVICE

Arrangement of stacked integrated circuit dice having a direct electrical connection

Bridge type pad structure of a semiconductor device

Semiconductor chip package and method for designing the same

INTEGRATED CIRCUIT

Integrated circuit packaging system for fine pitch substrates

SEMICONDUCTOR SUBSTRATES CONNECTED WITH A BALL GRID ARRAY

Integrated Support Structure for Stacked Semiconductors With Overhang

Integrated circuit package system with multiple devices

Lead frame package apparatus and method

SEMICONDUCTOR PACKAGE APPARATUS

Component and assemblies with ends offset downwardly

Method for forming semiconductor package and mold cast used for the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Connector with build-in control unit and its application

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Tapered dielectric and conductor structures and applications thereof

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Electrical connections for multichip modules

Integrated circuit having a semiconductor substrate with a barrier layer

Semiconductor device with heat sink and method for manufacturing the same

Stacked integrated circuit leadframe package system

LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor device package

Thin semiconductor die packages and associated systems and methods

SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor device and method of manufacturing the same