Methods for packaging image sensitive electronic devices

Semiconductor chip packages and methods for fabricating the same

Method of manufacturing semiconductor device

Magnetic shielding for magnetic random access memory card

Surface-mounting semiconductor device and method of making the same

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Integrated circuit with substantially perpendicular wire bonds

Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages

Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication

Semiconductor device having a heat-dissipation member

Method for heat dissipation on semiconductor device

Structure and process of semiconductor package with an exposed heatsink

Electronic component package

Apparatus for improved power distribution in wirebond semiconductor packages

Method of making a semiconductor device adapted to remove noise from a signal

SMT three phase inverter package and lead frame

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Method of manufacturing printed wiring board

Method of making circuitized substrate

Attachment of integrated circuit structures and other substrates to substrates with vias

Etched interposer for integrated circuit devices

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

Substrate for producing semiconductor packages

Methods and systems for attaching die in stacked-die packages

Stacked wafer scale package

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages

High frequency module and manufacturing method thereof

Invertible microfeature device packages

Semiconductor element

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Methods and apparatuses for providing stacked-die devices

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Integrated circuit package including miniature antenna

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Ceramic package, assembled substrate, and manufacturing method therefor

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods and apparatuses for providing stacked-die devices

Methods and systems for attaching die in stacked-die packages

Programmable radio transceiver

Selectively coating bond pads

Method for fabricating semiconductor package with circuit side polymer layer

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method of creating electrostatic discharge protection in a microelectronic module

Radio frequency power amplifier module

Semiconductor device with semiconductor components connected to one another

Component arrangement having an evaluation circuit for detecting wear on connections

Stacked chip package with exposed lead-frame bottom surface

Semiconductor device

Structure with spherical contact pins

Optical or electronic module and method for its production

Surface treatment for oxidation removal in integrated circuit package assemblies

Method of manufacturing circuit device

Stacked chip electronic package having laminate carrier and method of making same

Control unit and method for producing the same

Power amplifier arrangement and method for processing a radiofrequency signal

Interconnects with interlocks

Hermetic chip in wafer form

Power semiconductor package having integral fluid cooling

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor chip-embedded substrate and method of manufacturing same

Interposer with flexible solder pad elements and methods of manufacturing the same

Chip-under-tape package structure and manufacture thereof

Semiconductor package with stacked chips and method for fabricating the same

LOC semiconductor assembled with room temperature adhesive

Solderable metal finish for integrated circuit package leads and method for forming

Chip structure with redistribution traces

Semiconductor package having a grid array of pin-attached balls

Method for manufacturing plastic ball grid array package with integral heatsink

Magnetic shield for integrated circuit packaging

Active plate-connector device with built-in semiconductor dies

Microelectronic component assemblies with recessed wire bonds and methods of making same

High frequency semiconductor apparatus, transmitting apparatus and receiving apparatus

Heterogeneous organic laminate stack ups for high frequency applications

BGA package board and method for manufacturing the same

Semiconductor package and method for its manufacture

Electronic module with layer of adhesive and process for producing it

Resin encapsulation molding method for semiconductor device

Method for fabricating a semiconductor component with contacts situated at the underside

Castellation wafer level packaging of integrated circuit chips

Semiconductor chip resin encapsulation method

Methods of bonding two semiconductor devices

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Electronic device with semiconductor chip including a radiofrequency power module

Heat dissipation device for integrated circuits

Semiconductor package and method for its manufacture

Semiconductor device and manufacturing method therefor

Semiconductor package

Formation of a wire bond with enhanced pull

Electronic package having a folded flexible substrate and method of manufacturing the same

Semiconductor device

Castellation wafer level packaging of integrated circuit chips

Electronic device package

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Substrate based unmolded package

BGA package with concave shaped bonding pads

Thermal interposer for cooled electrical packages

Castellation wafer level packaging of integrated circuit chips

Semiconductor component having stacked, encapsulated dice and method of fabrication

Stacked semiconductor device and semiconductor memory module

Semiconductor device in which semiconductor chip is mounted on lead frame

Switch elements and a DC/DC converter using the same

Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Stacked package electronic device

Substrate based unmolded package

Method for fabricating semiconductor components using conductive layer and grooves

Housing for a semiconductor device and semiconductor device testing system for testing the contacting for semiconductor devices positioned one above the other

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Circuit device and manufacturing method thereof

Package stress management

Direct connection multi-chip semiconductor element structure

Low inductance semiconductor device having half-bridge configuration

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Semiconductor chip package with thermoelectric cooler

Integrated circuit package including embedded thin-film battery

Package Structure

Taped lead frames and methods of making and using the same in semiconductor packaging

Component interconnect with substrate shielding

Circular wire-bond pad, package made therewith, and method of assembling same

Modular board device, high frequency module, and method of manufacturing same

Heat sink formed of multiple metal layers on backside of integrated circuit die

Microelectronic devices and methods for forming interconnects in microelectronic devices

Leadless semiconductor package and method for manufacturing the same

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Method for fabricating semiconductor packages

Electronic device package

Methods for designing carrier substrates with raised terminals

Leadframe for a multi-chip package and method for manufacturing the same

Leadframe with a chip pad for two-sided stacking and method for manufacturing the same

Method and apparatus for mapping a position of a capillary tool tip using a prism

Electrostatic discharge (ESD) protection for integrated circuit packages

Method and structure for manufacturing improved yield semiconductor packaged devices

Arrangement for increasing the reliability of substrate-based BGA packages

Bottom heat spreader

Semiconductor package with exposed heat sink and the heat sink thereof

Multi-chip semiconductor connector assemblies

Method and system for expanding flash storage device capacity

Substrate-based die package with BGA or BGA-like components

Microelectronic packages and methods therefor

Method of embedding semiconductor element in carrier and embedded structure thereof

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Ultra thin dual chip image sensor package structure and method for fabrication

Flange-mounted transducer

Components with posts and pads

Method for encapsulating multiple integrated circuits

Heat spreader in integrated circuit package

Prefabricated semiconductor chip carrier

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Ground plane for integrated circuit package

Semiconductor device and manufacturing method therefor

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Semiconductor package having integrated metal parts for thermal enhancement

Semiconductor device

Compliant spring contact structures

Field weldable connections

Method for fabricating chip structure

Chip scale package with open substrate

Encapsulation for particle entrapment

Semiconductor device and semiconductor apparatus

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Semiconductor device mounted on and electrically connected to circuit board

Package and method for packaging an integrated circuit die

Internal package heat dissipator

Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly

Vertical conduction power electronic device package and corresponding assembling method

Embedded chip semiconductor having dual electronic connection faces

Metal substrate apparatus, method of manufacturing an IC card module apparatus, and an IC card module apparatus

Semiconductor device having inductor

Packaged microelectronic imagers and methods of packaging microelectronic imagers

Microelectronic imagers and methods of packaging microelectronic imagers

Nitride semiconductor device

Bonding apparatus

Spread spectrum isolator

Methods of making microelectronic packages

Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance

RF isolator for isolating voltage sensing and gate drivers

RF isolator with differential input/output

Transformer isolator for digital power supply

Semiconductor device and electronic apparatus

Method of making photolithographically-patterned out-of-plane coil structures

Electrical contact

Optimized driver layout for integrated circuits with staggered bond pads

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Ball grid array housing having a cooling foil

Conductor device and method of manufacturing thereof

Package for sealing an integrated circuit die

Internal package heat dissipator

Semiconductor equipment having multiple semiconductor devices and multiple lead frames

On chip transformer isolator

Semiconductor device

Corrosion resistance enhancement of tin surfaces

Manufacturing method of semiconductor device

Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units

Wiring substrate and method of fabricating the same

Semiconductor integrated circuit device and method for fabricating the same

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier

Circuit device and manufacturing method thereof

Cold weld hermetic MEMS package and method of manufacture

Interposer substrate, semiconductor package and semiconductor device, and their producing methods

Method of fabricating a semiconductor device used in a stacked-type semiconductor device

Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment

Integrated circuit leadframe and fabrication method therefor

Layout structure for providing stable power source to a main bridge chip substrate and a motherboard

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Substrate holding apparatus

Moisture-resistant electronic device package and methods of assembly

Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnection

Multi-band tunable resonant circuit

Package with barrier wall and method for manufacturing the same

Method for fabricating leadless packages with mold locking characteristics

Method and system for applying an adhesive substance on an electronic device

Semiconductor device and interposer

Semiconductor molding method and structure

Fine-pitch packaging substrate and a method of forming the same

Double density method for wirebond interconnect

Semiconductor device, method for mounting the same, and method for repairing the same

Leadless leadframe with an improved die pad for mold locking

Packaged integrated circuit with MLP leadframe and method of making same

Semiconductor device and manufacturing method therefor

Packaging of a microchip device

Chemical-enhanced package singulation process

Method of attaching a leadframe to singulated semiconductor dice

Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device

Universal interconnect die

Semiconductor device

Integrated passive devices

High electrical performance semiconductor package

Mold gates and tape substrates including the mold gates

Semiconductor device structure with adhesion-enhanced semiconductor die

Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly

Systems for degating packaged semiconductor devices with tape substrates

Method of forming an array of semiconductor packages

Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly

Resin-molded package with cavity structure

Die package

Semiconductor micro device

Microelectronic assembly having a perimeter around a MEMS device

Semiconductor (LED) chip attachment

Method of bumping die pads for wafer testing

Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Wiring board and semiconductor package using the same

Method and apparatus for decoupling conductive portions of a microelectronic device package

Method for internal electrical insulation of a substrate for a power semiconductor module

Preserving solderability and inhibiting whisker growth in tin surfaces of electronic components

Whisker inhibition in tin surfaces of electronic components

Current sensor

Electronic device with high lead density

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

High data rate chip mounting

Electronic circuit package

Chip-packaging with bonding options having a plurality of package substrates

Optical surface mount technology package

Surface mount multichip devices

Leads under chip IC package

Semiconductor device

Methods of forming conductive through-wafer vias

Linear split axis wire bonder

Single row bond pad arrangement

Microelectronic connection components having bondable wires

Method and apparatus for synthesizing high-frequency signals for wireless communications

Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging

Test circuit under pad

High voltage power device with low diffusion pipe resistance

Method for producing a BGA chip module and BGA chip module

Method for manufacturing an adhesive substrate with a die-cavity sidewall

Wire bonding system and method of use

Semiconductor package for a large die

Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

Semiconductor device in which semiconductor chip is mounted on lead frame

Semiconductor device, semiconductor circuit and method for producing semiconductor device

Laminate ceramic circuit board and process therefor

Compliant interconnect assembly

Method of manufacturing multi-stack package

Semiconductor package having multiple row of leads

High power Doherty amplifier

Semiconductor chip package

Microelectronic assembly having a redistribution conductor over a microelectronic die

Bonding pad structure and method of forming the same

Flip-chip type semiconductor devices and conductive elements thereof

Semiconductor device

CARRIER, CHIP PACKAGE STRUCTURE, AND CIRCUIT BOARD PACKAGE STRUCTURE

Semiconductor device and multilayer substrate therefor

Semiconductor device and printed circuit board

Semiconductor packages, and methods of forming semiconductor packages

Display device

Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Leadframe packaging structure and the method of manufacturing the same

CHIP PACKAGING STRUCTURE

Semiconductor integrated circuit

Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package

Programmable radio transceiver

Wafer level mounting frame for ball grid array packaging, and method of making and using the same