Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device and manufacturing method thereof

Bilayer aluminum last metal for interconnects and wirebond pads

Surface mount semiconductor device

Chip package and producing method thereof

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Semiconductor device with sense structure

Method and apparatus for forming a low profile wire loop

Wire bonding apparatus

Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces

Method for designing integrated circuit package and method for manufacturing same

System-in-package wireless communication device comprising prepackaged power amplifier

VSAT block up converter (BUC) chip

Method of making a compliant interconnect assembly

Method in the fabrication of a memory device

Fabrication of stacked microelectronic devices

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Method for making a semiconductor multi-package module having inverted bump chip carrier second package

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Semiconductor device including multiple rows of peripheral circuit units

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Structure for joining a semiconductor package to a substrate using a solder column

Multimedia card and transfer molding method

Low profile ball-grid array package for high power

Semiconductor package using flexible film and method of manufacturing the same

Camera-assisted adjustment of bonding head elements

Cooling structure of solid state and formation thereof with integrated package

Die paddle clamping method for wire bond enhancement

Integrated packaged having magnetic components

Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same

Semiconductor device

Electronic component and leadframe for producing the component

Semiconductor chip packaging apparatus and method of manufacturing semiconductor chip package

Semiconductor device having a particular electrode structure

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Semiconductor chip stack package having dummy chip

Lead frame routed chip pads for semiconductor packages

Leadframe and semiconductor package made using the leadframe

On-pad broadband matching network

Semiconductor device with split pad design

Wire loop, semiconductor device having same and wire bonding method

Method of manufacturing a cavity package

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Semiconductor device package and manufacturing method thereof

BGA package substrate and method of fabricating same

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Mounting pad structure for wire-bonding type lead frame packages

Semiconductor package having passive component disposed between semiconductor device and substrate

Multi-chip package mounted memory card

Leadframe designs for plastic cavity transistor packages

Semiconductor package having enhanced heat dissipation and method of fabricating the same

On-chip circuit pad structure

Semiconductor device

Method for making semiconductor multi-package module having inverted second package and including additional die or package stacked on second package

Semiconductor device

Packaging for electronic modules

Stacked electronic component and manufacturing method thereof

Arrangement for energy conditioning

Semiconductor device with mechanism for leak defect detection

Intelligent high-power amplifier module

Semiconductor device for high frequency power amplification

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA) package

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

High power light emitting diode device

Multi-chip package structure

Stack chip package

Microelectronic packages using a ceramic substrate having a window and a conductive surface region

Accessible electronic storage apparatus

Semiconductor package and lead frame therefor

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Semiconductor device and radio communication device

Semiconductor device and manufacturing method therefor

Wafer structure, chip structure, and fabricating process thereof

Method of marking a low profile packaged semiconductor device

Packaged semiconductor die and manufacturing method thereof

Package that integrates passive and active devices with or without a lead frame

Methods of forming semiconductor packages

Semiconductor package with a controlled impedance bus

Module

Leadframe and packaged light emitting diode

Carrier with metal bumps for semiconductor die packages

PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Multi lead frame power package

Ball grid array substrate having window and method of fabricating same

Semiconductor device with a substrate having a spiral shaped coil

Multi-chip package structure

Multi-chip package structure

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Packaged electronic devices, and method for making same

Semiconductor device package with reduced leakage

Methods of making and using a floating lead finger on a lead frame

Use of a down-bond as a controlled inductor in integrated circuit applications

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Monolithic microwave integrated circuit compatible FET structure

PCB, manufacturing method thereof and semiconductor package implementing the same

Memory package

Semiconductor device package

Compact system module with built-in thermoelectric cooling

Housing for power semiconductor modules

Transceiver using low temperature co-fired ceramic method

Multi-chip module

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Thermally enhanced package for an integrated circuit

Heat dissipating semiconductor package and fabrication method thereof

Lead frame for semiconductor device

Integrated circuit with stacked-die configuration utilizing substrate conduction

Semiconductor package having improved adhesion and solderability

Methods for fabricating stiffeners for flexible substrates

Carrier-free semiconductor package and fabrication method thereof

Thermal management of surface-mount circuit devices

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packaging

Semiconductor package, memory card including the same, and mold for fabricating the memory card

Lead frame assemblies and decoupling capacitors

Sharp corner lead frame

Memory cards and method of fabricating the memory cards

Methods for assembling a stack package for high density integrated circuits

Bond pad for ball grid array package

Multi-chip module

Heat stud for stacked chip package

Chip package mechanism

Semiconductor device with improved heat dissipation

connection arrangement for micro lead frame plastic packages

Microelectronic assemblies incorporating inductors

Simplified multichip packaging and package design

Integrated circuit including silicon wafer with annealed glass paste

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Semiconductor device, and method for manufacturing the same

Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same

Method for two-stage transfer molding device to encapsulate MMC module

Multilayered circuit substrate, semiconductor device and method of producing same

Thermal management of surface-mount circuit devices on laminate ceramic substrate

Semiconductor component package

Multi-chip package and method of fabricating the same

Multi-chip package using an interposer

Package structure of memory card and packaging method for the structure

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Leadframe designs for integrated circuit plastic packages

ESD protection apparatus for an electrical device

Electronic device and method of manufacturing the same

Semiconductor chip package having an adhesive tape attached on bonding wires

Techniques for microchannel cooling

Electronic device with high lead density

Hybrid card

Power amplifier module

System-in-package type semiconductor device

Methods and systems for rise-time improvements in differential signal outputs

BGA package having substrate with exhaust hole

Semiconductor package system with substrate heat sink

Integrated circuit package system with heat slug

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Integrated circuit package system with leadframe substrate

Multilayered lead frame for a semiconductor light-emitting device

Active area bonding compatible high current structures

Tolerance bondwire inductors for analog circuitry

Micro lead frame packages and methods of manufacturing the same

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Wire positioning and mechanical attachment for a radio-frequency indentification device

Semiconductor package device and method for fabricating the same

Integration type semiconductor device and method for manufacturing the same

Staggered wirebonding configuration

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Chip package with grease heat sink

Substrate for electrical device and methods for making the same

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit die with logically equivalent bonding pads

Multi-chip package

Methods for designing and tuning one or more packaged integrated circuits

Electrical contact and connector and method of manufacture

Method for fabricating semiconductor components

Methods of manufacturing interposers with flexible solder pad elements

Method of manufacturing a wafer assembly

Cavity-down Package and Method for Fabricating the same

Electronic component comprising external surface contacts and a method for producing the same

Circuitized substrate with trace embedded inside ground layer

Land grid array module

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Cavity-down thermally enhanced package

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Multiple die stack apparatus employing t-shaped interposer elements

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Stacked semiconductor multi-chip package

Flip chip package including a non-planar heat spreader and method of making the same

Power distribution within a folded flex package method and apparatus

IC package structures having separate circuit interconnection structures and assemblies constructed thereof

Low cost power MOSFET with current monitoring

Chip package, chip packaging, chip carrier and process thereof

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Multilayer semiconductor device

Thermally enhanced molded package for semiconductors

IC substrate and manufacturing method thereof and semiconductor element package thereby

Cavity-down multiple-chip package

Semiconductor device having element portion and control circuit portion

Circuit carrier and production thereof

Packaging method for an electronic element

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Heat dissipating package structure and method for fabricating the same

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Memory card module with an inlay design

Multichip leadframe package

Semiconductor HBT MMIC device and semiconductor module

Flexible circuit board processing method

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Folded substrate with interposer package for integrated circuit devices

Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency

Stacked die module

Semiconductor component with plastic housing, and process for producing the same

Attachment of integrated circuit structures and other substrates to substrates with vias

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Semiconductor package structure with microstrip antennan

Die attach paddle for mounting integrated circuit die

Semiconductor device

Wire bonder

Contour structures to highlight inspection regions

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Power semiconductor module

Mold compound interlocking feature to improve semiconductor package strength

Semiconductor device using multi-layer unleaded metal plating, and method of manufacturing the same

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Semiconducting device that includes wirebonds

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Lead frame and semiconductor package therefor

Active device bases, leadframes utilizing the same, and leadframe fabrication methods

ELECTRICAL PACKAGE STRUCTURE INCLUDING CHIP WITH POLYMER THEREON

Lead frame and light receiving module comprising it

Semiconductor device having power semiconductor elements

Nano-sized metals and alloys, and methods of assembling packages containing same

Radio frequency module and manufacturing method thereof

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Package stress management

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Method for manufacturing wafer level chip scale package structure

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Electronic device

Chip package

Bonding apparatus

Semiconductor device and method for manufacturing the same

Method for producing a packaged integrated circuit

Stacked die module and techniques for forming a stacked die module

Semiconductor device

Devices and systems for electrostatic discharge suppression

Production methods for a leadframe and electronic devices

Electronic package having a folded package substrate

Semiconductor package, and fabrication method and carrier thereof

Assembly for stacked BGA packages

Semiconductor device package

Semiconductor device and semiconductor device unit

Motion control device for wire bonder bondhead

Integrated radio frequency module

Wafer stacking package method

Method of forming a wafer backside interconnecting wire

Light-emitting semiconductor device having an overvoltage protector

Semiconductor device and a method of assembling a semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Semiconductor packages

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Methods of forming semiconductor packages

Integrated heatspreader for use in wire bonded ball grid array semiconductor packages

Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor

Apparatus for and method of packaging semiconductor devices

Multi-chip package structure

Semiconductor packages

Integrated circuit package with open substrate

Physical quantity sensor, lead frame, and manufacturing method therefor

Module assembly and method for stacked BGA packages

Method of clearing electrical contact pads in thin film sealed OLED devices

Method of forming precision leads on a chip-supporting leadframe

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Package having dummy package substrate and method of fabricating the same

Chip module

Semiconductor chip stack structure and method for forming the same

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

High density interconnect power and ground strap and method therefor

Module assembly for stacked BGA packages

Substrate-based housing component with a semiconductor chip

Package having dummy package substrate and method of fabricating the same

Semiconductor device

Lead frame and semiconductor device having the lead frame

Method of making circuitized substrate