210112 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors Disposition
Sub-classes:Semiconductor packages
#2High voltage semiconductor devices having improved electric field suppression
#3Semiconductor packages
#4Power semiconductor device load terminal
#5Power semiconductor device load terminal
#6Semiconductor device
#7Quad flat no-lead package and manufacturing method thereof