210114 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors; Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
#2DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
#3BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#4SEMICONDUCTOR DEVICES INCLUDING STACKED DIES WITH INTERLEAVED WIRE BONDS AND ASSOCIATED SYSTEMS AND METHODS
#5HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
#6DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF
#7LOW CAPACITANCE ESD PROTECTION DEVICES
#8REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
#9INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
#10MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#11Display apparatus and manufacturing method thereof
#12METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
#13PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUENCY DEVICE
#14Semiconductor package
#15Semiconductor devices including stacked dies with interleaved wire bonds and associated systems and methods
#16Display apparatus having a semiconductor light emitting source
#17Semiconductor memory device
#18BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#19Display apparatus and manufacturing method thereof
#20Circuit structure
#21Semiconductor memory device
#22MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#23Display apparatus and manufacturing method thereof
#24Semiconductor device and method for manufacturing semiconductor device
#25High voltage semiconductor devices having improved electric field suppression
#26Semiconductor device manufacturing method and soldering support jig
#27Bottom package exposed die MEMS pressure sensor integrated circuit package design
#28Method of manufacturing semiconductor device
#29Magnetically coupled galvanically isolated communication using lead frame
#30SEMICONDUCTOR DEVICE
#31Display apparatus and manufacturing method thereof
#32Power semiconductor device that includes a copper layer disposed on an electrode and located away from a polyimide layer and method for manufacturing the power semiconductor device
#33Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#34Semiconductor device and manufacturing method thereof
#35Semiconductor apparatus
#36Semiconductor device manufacturing method and soldering support jig
#37MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#38Power semiconductor device load terminal
#39Stackable microelectronic package structures
#40Magnetically coupled galvanically isolated communication using lead frame
#41Manufacturing method of semiconductor device
#42Low CTE interposer
#43Systems and methods providing a matching circuit that bypasses a parasitic impedance
#44FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#45Bottom package exposed die MEMS pressure sensor integrated circuit package design
#46Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#47Semiconductor device including sensor and driving terminals spaced away from the semiconductor device case wall
#48Semiconductor package having multi-phase power inverter with internal temperature sensor
#49Power semiconductor device load terminal
#50Power overlay structure and reconstituted semiconductor wafer having wirebonds
#51Compact semiconductor package and related methods
#52Low CTE interposer
#53Multichip, battery protection apparatus, and battery pack
#54Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#55Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#56Semiconductor device and manufacturing method
#57Magnetically coupled galvanically isolated communication using lead frame
#58Apparatus and semiconductor structure including a multilayer package substrate
#59Compact semiconductor package and related methods
#60High-frequency module
#61Power overlay structure having wirebonds and method of manufacturing same
#62Stackable molded microelectronic packages with area array unit connectors
#63Field effect transistor and semiconductor device
#64Method of manufacturing semiconductor device
#65Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#66Semiconductor device and manufacturing method
#67Electronic component device
#68Bonding pad arrangment design for multi-die semiconductor package structure
#69Enhanced flash chip and method for packaging chip
#70Magnetically coupled galvanically isolated communication using lead frame
#71Light-emitting module
#72Stackable microelectronic package structures
#73Semiconductor device having mirror-symmetric terminals and methods of forming the same
#74Stackable microelectronic package structures
#75Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
#76Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#77Power semiconductor module having pattern laminated region
#78Semiconductor package and method of fabricating the same
#79Submount, encapsulated semiconductor element, and methods of manufacturing the same
#80Power semiconductor device
#81Stack packages having token ring loops
#82Semiconductor package including multiple chips and separate groups of leads
#83Light emitting module
#84Semiconductor packages and electronic systems including the same
#85Semiconductor device
#86Low CTE interposer
#87High-frequency module
#88Shielded gate trench MOSFET package
#89Semiconductor package including multiple chips and separate groups of leads
#90Device including a semiconductor chip and wires
#91Semiconductor device
#92Stackable microelectronic package structures
#93Semiconductor packages and electronic systems including the same
#94Switch mode power converters using magnetically coupled galvanically isolated lead frame communication
#95Method of manufacturing semiconductor device
#96Semiconductor package having multi-phase power inverter with internal temperature sensor
#97Semiconductor device including semiconductor chip mounted on lead frame
#98Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier
#99High temperature interconnect assemblies for high temperature electronics utilizing transition pads
#100Integrated circuit packaging system with array contacts and method of manufacture thereof
#101Packaging and methods for packaging
#102Semiconductor device
#103Power module
#104Semiconductor device and method of manufacturing the semiconductor device
#105Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same
#106Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#107Integrated circuit chip using top post-passivation technology and bottom structure technology
#108Joint structure for substrates and methods of forming
#109Protection layers for conductive pads and methods of formation thereof
#110Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor
#111Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure
#112Semiconductor device
#113Stackable microelectronic package structures
#114Chip package structure
#115Integrated circuit packages having redistribution structures
#116Semiconductor package
#117Power semiconductor package with conductive clip
#118Device having multiple wire bonds for a bond area and methods thereof
#119Semiconductor packages and electronic systems including the same
#120Low CTE interposer
#121Multi-chip packages providing reduced signal skew and related methods of operation
#122SYSTEM AND METHOD FOR PROVIDING IMPROVED IMPEDANCE MATCHING TO RF POWER TRANSISTOR USING SHUNT INDUCTANCE
#123Light emitting module
#124UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME
#125Shielded gate trench MOSFET package
#126Semiconductor device reducing risks of a wire short-circuit and a wire flow
#127Semiconductor packages and electronic systems including the same
#128Method of manufacturing semiconductor device
#129Externally Wire Bondable Chip Scale Package in a System-in-Package Module
#130Semiconductor device and manufacturing method
#131METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#132PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#133Light emitting device package and lighting system
#134SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
#135Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#136Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#137Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof
#138IGBT power semiconductor package having a conductive clip
#139Semiconductor package including multiple chips and separate groups of leads
#140Determining intra-die wirebond pad placement locations in integrated circuit
#141Semiconductor device and method for manufacturing the same
#142Rule-based semiconductor die stacking and bonding within a multi-die package
#143Semiconductor device and method of manufacturing the semiconductor device
#144Semiconductor device and wiring board
#145Microelectronic package and method of manufacturing same
#146Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip
#147Stacked microelectronic dies and methods for stacking microelectronic dies
#148Integrated circuit package system with stacked die
#149ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#150Submount and manufacturing method thereof
#151Manufacturing method of semiconductor device
#152Semiconductor device
#153SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#154Semiconductor package
#155Stacked assembly including plurality of stacked microelectronic elements
#156SEMICONDUCTOR DEVICE
#157Package and fabrication method of the same
#158Integrated circuit package with voltage distributor
#159Power semiconductor device
#160SEMICONDUCTOR PACKAGE
#161Power module
#162Stackable molded microelectronic packages with area array unit connectors
#163Semiconductor device assembly and method thereof
#164High density chip stacked package, package-on-package and method of fabricating the same
#165Stacked package and method of manufacturing the same
#166Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
#167Semiconductor device
#168Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
#169Stacked package
#170Semiconductor chip package including a lead frame
#171Microelectronic assembly with joined bond elements having lowered inductance
#172Bonding wire profile for minimizing vibration fatigue failure
#173Method for interconnecting electrical device to a module
#174Illumination apparatus having a plurality of semiconductor light-emitting devices
#175Semiconductor device and a manufacturing method of the same
#176Semiconductor package structure and package process
#177SEMICONDUCTOR DEVICE
#178Integrated circuit packaging system with leads and method of manufacture thereof
#179Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
#180Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#181Microwave circuit package
#182Printed circuit board (PCB) including a wire pattern, semiconductor package including the PCB, electrical and electronic apparatus including the semiconductor package, method of fabricating the PCB, and method of fabricating the semiconductor package
#183Semiconductor device and electronic device
#184Rule-based semiconductor die stacking and bonding within a multi-die package
#185Semiconductor package
#186SEMICONDUCTOR DEVICE
#187Power semiconductor device
#188Semiconductor device
#189Semiconductor device
#190Semiconductor device module
#191Method of manufacturing semiconductor device
#192SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
#193Inductive relayed coupling circuit between substrates
#194Method of manufacturing semiconductor device
#195Microelectronic assembly with joined bond elements having lowered inductance
#196POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS
#197Power module assembly with reduced inductance
#198SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME
#199POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME
#200Semiconductor package and method of manufacturing the semiconductor package
#201Printed wiring board and method for manufacturing the same
#202Semiconductor package
#203QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME
#204Method for manufacturing semiconductor device
#205Semiconductor package requiring reduced manufacturing processes
#206Lighting device, display, and method for manufacturing the same
#207Stacked chip package structure with leadframe having inner leads with transfer pad
#208Semiconductor device and method for fabricating the same
#209Semiconductor package
#210QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF
#211Semiconductor power module
#212Method for fabricating QFN semiconductor package
#213Semiconductor chip and semiconductor device including the same
#214Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same
#215QFN semiconductor package
#216QFN semiconductor package
#217Semiconductor device and method of manufacturing the semiconductor device
#218Semiconductor packages and electronic systems including the same
#219Multi-chip packages providing reduced signal skew and related methods of operation
#220Semiconductor chip package
#221STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#222Integrated circuit chip using top post-passivation technology and bottom structure technology
#223Stacked multichip package
#224Semiconductor packages and electronic systems including the same
#225Multi-chip packages including extra memory chips to define additional logical packages and related devices
#226Semiconductor device and wire bonding method
#227Semiconductor device having finger electrodes
#228FLMP buck converter with a molded capacitor and a method of the same
#229Electronic device
#230Semiconductor apparatus with decoupling capacitor
#231Semiconductor device and wire bonding method
#232Method of manufacturing semiconductor device
#233SEMICONDUCTOR DEVICE
#234Semiconductor device which exposes die pad without covered by interposer and its manufacturing method
#235Metal schemes of trench MOSFET for copper bonding
#236SEMICONDUCTOR DEVICE
#237Semiconductor package and plasma display device including the same
#238Semiconductor element and electrical apparatus
#239Semiconductor device having a mounting substrate with a capacitor interposed therebetween
#240Semiconductor element and electrical apparatus
#241Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
#242Wire-on-lead package system having leadfingers positioned between paddle extensions and method of manufacture thereof
#243High frequency semiconductor device
#244Semiconductor chip stacked body and method of manufacturing the same
#245Chip package and manufacturing method thereof
#246Integrated circuit packaging system with multi level contact and method of manufacture thereof
#247Semiconductor package
#248Method for forming an isolated inner lead from a leadframe
#249Semiconductor package including multiple chips and separate groups of leads
#250Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#251Semiconductor packing having offset stack structure
#252Semiconductor device including semiconductor chip mounted on lead frame
#253Semiconductor package system with cavity substrate and manufacturing method therefor
#254SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD
#255PACKAGE, AND FABRICATION METHOD FOR THE PACKAGE
#256Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate
#257Chip package structure and fabricating method thereof
#258CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
#259ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#260Advanced quad flat non-leaded package structure and manufacturing method thereof
#261Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
#262Semiconductor structure with communication element
#263Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
#264Method for fabricating package structure of stacked chips
#265IC Package Method Capable of Decreasing IR Drop and Associated IC Apparatus
#266Optical semiconductor apparatus
#267Method and System for Secure Heat Sink Attachment on Semiconductor Devices with Macroscopic Uneven Surface Features
#268Method of manufacturing a stacked semiconductor apparatus
#269Power semiconductor device
#270Chip-Stacked Package Structure with Leadframe Having Multi-Piece Bus Bar
#271Semiconductor device
#272WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE
#273Semiconductor device and manufacturing method for the same
#274METHOD OF FABRICATING WIRE ON WIRE STITCH BONDING IN A SEMICONDUCTOR DEVICE
#275STACKED DIE PACKAGE
#276Semiconductor device assembly and method thereof
#277Integrated circuit package system with shield and tie bar
#278Power semiconductor device
#279QFN Semiconductor package
#280Method of fabricating chip package
#281High density memory device manufacturing using isolated step pads
#282Semiconductor device
#283Chip package
#284METHOD FOR MANUFACTURING STACK CHIP PACKAGE STRUCTURE
#285Semiconductor device and manufacturing method of the same
#286Semiconductor device package
#287Integrated circuit package system with stacking module
#288Method and apparatus for a package having multiple stacked die
#289Integrated circuit package system with support structure for die overhang
#290Semiconductor device and method of manufacturing the same
#291Intermediate Bond Pad for Stacked Semiconductor Chip Package
#292Method of fabricating chip package structure
#293STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#294Semiconductor package apparatus having redistribution layer
#295High power integrated RF amplifier
#296Radio frequency over-molded leadframe package
#297IC MODULE, IC INLET, AND IC MOUNTED BODY
#298Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits
#299Integrated circuit package system with shielding
#300Method of forming a wafer level package