210114 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors; Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
Semiconductor device
#302Integrated circuit packaging system with interposer
#303Electronic device
#304Wire bonding personalization and discrete component attachment on wirebond pads
#305Touch screen system with light reflection
#306Metal foil interconnection of electrical devices
#307Chip package
#308Power device packages and methods of fabricating the same
#309Semiconductor package
#310Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#311High capacity memory with stacked layers
#312Semiconductor integrated circuit device, PDP driver, and plasma display panel
#313Stacked package and method of manufacturing the same
#314SEMICONDUCTOR DEVICE
#315Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure
#316Electronic device
#317Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire
#318Semiconductor apparatus with decoupling capacitor
#319ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
#320SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURING
#321Light emitting diode device
#322Three-Dimensional Memory-Based Three-Dimensional Memory Module
#323Package structure for multiple die stack
#324Semiconductor apparatus
#325Semiconductor apparatus
#326Method of fabricating stacked assembly including plurality of stacked microelectronic elements
#327Power semiconductor module
#328Leadframe-based semiconductor package
#329Semiconductor device and method of providing common voltage bus and wire bondable redistribution
#330Semiconductor stack package having wiring extension part which has hole for wiring
#331Arrangement of stacked integrated circuit dice having a direct electrical connection
#332QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS
#333Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip
#334Integrated circuit package system having perimeter paddle
#335Integrated circuit die with logically equivalent bonding pads
#336Packages and assemblies including lidded chips
#337LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD
#338RF-coupled digital isolator
#339RF-coupled digital isolator
#340Semiconductor device
#341Semiconductor device
#342Semiconductor device comprising a semiconductor chip stack and method for producing the same
#343Semiconductor device
#344Semiconductor device
#345Chip package structure
#346METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#347Semiconductor device with different sized ESD protection elements
#348Semiconductor device with Al pad
#349Semiconductor device including mounting board with stitches and first and second semiconductor chips
#350Base substrate for chip scale packaging
#351CHIP PACKAGE AND METHOD OF FABRICATING THE SAME
#352Semiconductor module
#353Semiconductor device and method of manufacturing same
#354Power semiconductor module and method for producing the same
#355Interposer for die stacking in semiconductor packages and the method of making the same
#356Electronic component structure and method of making
#357CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#358Package structure and method for chip with two arrays of bonding pads on BGA substrate for preventing gold bonding wires from collapse
#359Integrated circuit packaging system with interposer
#360Semiconductor device manufacturing method, semiconductor device, and wiring board
#361Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same
#362CHIP PACKAGE STRUCTURE
#363Integrated circuit package system with offset stacked die and method of manufacture thereof
#364Memory device
#365IC package encapsulating a chip under asymmetric single-side leads
#366Multi-chip package
#367Semiconductor device and electronic device
#368Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof
#369Method of making semiconductor device
#370High power semiconductor package and method of making the same
#371LDO regulator with ground connection through package bottom
#372Amplifier chip mounted on a lead frame
#373CHIP PACKAGE AND FABRICATING PROCESS THEREOF
#374Semiconductor device
#375Semiconductor device and method for manufacturing same
#376Bondwire utilized for coulomb counting and safety circuits
#377Stacked chip package structure with leadframe having inner leads with transfer pad
#378CONNECTING A PLURALITY OF BOND PADS AND/OR INNER LEADS WITH A SINGLE BOND WIRE
#379Stacked chip packaging with heat sink structure
#380CHIP PACKAGE STRUCTURE
#381ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE
#382Light emitting device
#383Integrated circuit package system with stacked die
#384Methods using die attach paddle for mounting integrated circuit die
#385Die attach paddle for mounting integrated circuit die
#386Chip-stacked package structure having leadframe with multi-piece bus bar
#387Chip-stacked package structure for lead frame having bus bars with transfer pads
#388Electronic device having wiring substrate and lead frame
#389Illumination apparatus having a plurality of semiconductor light-emitting devices
#390Compact impedance transformation circuit
#391Semiconductor memory device and semiconductor device
#392CHIP CARRIER WITH SIGNAL COLLECTION TAPE AND FABRICATION METHOD THEREOF
#393Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time
#394Light emitting device
#395Lead frame with included passive devices
#396Integrated circuit package-in-package system
#397SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
#398Semiconductor device and its wiring method
#399Semiconductor device and its wiring method
#400Semiconductor device
#401Semiconductor device and manufacturing method for the same
#402Chip package structure
#403Interconnect structure for semiconductor package
#404CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
#405Chip package structure and fabricating method thereof
#406Semiconductor apparatus with decoupling capacitor
#407DIE STACK CAPACITORS, ASSEMBLIES AND METHODS
#408Stacked package electronic device
#409Integrated circuit package and multi-layer lead frame utilized
#410No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#411Package structure
#412Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips
#413Method of forming stackable package
#414Semiconductor power module including epoxy resin coating
#415Integrated circuit package system with ground ring
#416Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement
#417Multichip package system
#418Semiconductor device and manufacturing method thereof
#419Connecting a plurality of bond pads and/or inner leads with a single bond wire
#420Microelectromechanical system assembly and method for manufacturing thereof
#421Stacked microelectronic device assemblies
#422Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#423CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE
#424Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#425Multi-chips module package and manufacturing method thereof
#426Semiconductor package structure and fabrication method thereof
#427Semiconductor package structure and fabrication method thereof
#428CHIP PACKAGE WITH BUILT-IN CAPACITOR STRUCTURE
#429Arrangement and method impedance matching
#430Semiconductor-element mounting substrate, semiconductor device, and electronic equipment
#431Semiconductor device
#432Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
#433System and method for implementing transformer on package substrate
#434Metal-base circuit board and its manufacturing method
#435High-temperature solder, high-temperature solder paste and power semiconductor using same
#436Interposer and stacked chip package
#437Semiconductor device having a heat spreader exposed from a seal resin
#438Method for fabricating semiconductor package
#439Method for fabricating semiconductor package with stacked chips
#440Semiconductor device and method of manufacturing the same
#441Multi-stack chip package with wired bonded chips
#442High frequency chip packages with connecting elements
#443Semiconductor heat-transfer method
#444Integrated circuit mounting for thermal stress relief useable in a multi-chip module
#445Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
#446Light transmission/reception module and light transmission/reception device
#447Decoupling capacitor closely coupled with integrated circuit
#448Apparatus and method for providing bypass capacitance and power routing in QFP package
#449Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof
#450Decoupling capacitor closely coupled with integrated circuit
#451INDUCTIVE STRUCTURE
#452Die pad for semiconductor packages and methods of making and using same
#453Multi-chip package type semiconductor device
#454Quad flat pack (QFP) package and flexible power distribution method therefor
#455Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
#456Semiconductor device and a manufacturing method of the same
#457Radio frequency over-molded leadframe package
#458Relay board with bonding pads connected by wirings
#459Adhesive layer forming a capacitor dielectric between semiconductor chips
#460SIP type package containing analog semiconductor chip and digital semiconductor chip stacked in order, and method for manufacturing the same
#461Semiconductor device and fabrication method thereof
#462Bondwire utilized for coulomb counting and safety circuits
#463Semiconductor device and electronic device
#464Semiconductor device with electrically isolated ground structures
#465Semiconductor device and a manufacturing method of the same
#466Package structure having mixed circuit and composite substrate
#467Semiconductor structure with RF element
#468Double density method for wirebond interconnect
#469Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
#470Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device
#471Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded
#472Methods for assembling semiconductor devices and interposers
#473Semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#474Semiconductor device
#475Semiconductor device and its writing method
#476Semiconductor device including capsule type semiconductor package and semiconductor chip in stacking manner
#477Chip-type noise filter, manufacturing method thereof, and semiconductor package
#478Semiconductor device
#479INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER
#480PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCE
#481Semiconductor package and fabrication method thereof
#482Microelectronic assemblies incorporating inductors
#483Methods and systems for rise-time improvements in differential signal outputs
#484Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound
#485Integrated circuit die with logically equivalent bonding pads
#486Semiconductor device having element portion and control circuit portion
#487Stacked die module
#488Die attach paddle for mounting integrated circuit die
#489Semiconductor device
#490Semiconductor device having a switch circuit
#491Tape ball grid array package with electromagnetic interference protection and method for fabricating the package
#492Method of creating electrostatic discharge protection in a microelectronic module
#493Semiconductor device and method of manufacturing same
#494Semiconductor package with stacked chips and method for fabricating the same
#495Stacked package electronic device
#496Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#497Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#498Optical modulator module
#499Semiconductor device and a method of manufacturing the same
#500Double density method for wirebond interconnect
#501Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#502Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#503Semiconductor device
#504Microelectronic assembly having a redistribution conductor over a microelectronic die
#505Semiconductor device for power MOS transistor module
#506Interposer including adhesive tape
#507Wire bonding method and semiconductor device
#508Multi-chip package
#509Semiconductor device and electronic device
#510Multi-chip package including at least one semiconductor device enclosed therein
#511Apparatus for encapsulating a multi-chip substrate array
#512Chip-on-board module, and method of manufacturing the same
#513Semiconductor device, semiconductor laser device, manufacturing method for semiconductor device, manufacturing method for semiconductor laser device, optical disk device and optical transmission system
#514High performance RF inductors and transformers using bonding technique
#515Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#516Junction member comprising junction pads arranged in matrix and multichip package using same
#517Electronic device having wiring substrate and lead frame
#518Semiconductor device and manufacturing method thereof
#519Semiconductor package with increased number of input and output pins
#520Semiconductor device and method of manufacturing thereof
#521Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
#522Semiconductor chip and semiconductor device including lamination of semiconductor chips
#523Semiconductor laser device
#524Semiconductor apparatus with decoupling capacitor
#525BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
#526High-frequency chip packages
#527Method for assembling a ball grid array package with multiple interposers
#528Multi-chips module package and manufacturing method thereof
#529Method of making a semiconductor device having an opening in a solder mask
#530Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#531Method of making a semiconductor device having an opening in a solder mask
#532Transistor with improved safe operating area
#533Method for opening the plastic housing of an electronic module
#534Stack package of semiconductor device
#535Leadless leadframe package substitute and stack package