210138 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location prior to the connecting process on the same surface; Bump and layer connectors the bump connector being embedded into the layer connector
Co-axial restraint for connectors within flip-chip packages
#302METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE STRUCTURE
#303Method for fabricating flip-attached and underfilled semiconductor devices
#304ENCAPSULATING RESIN SHEET AND SEMICONDUCTOR DEVICE USING THE SAME, AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE
#305Semiconductor package and method for manufacturing the same
#306METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE
#307Semiconductor device, method for manufacturing the same, and data processing device
#308Semiconductor device having a semiconductor chip, and method for the production thereof
#309Wafer level molding structure
#310ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
#311WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#312Method of assembling two integrated circuits and corresponding structure
#313Semiconductor device and method of manufacturing semiconductor device
#314BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
#315ANISOTROPIC CONDUCTIVE ADHESIVE FOR ULTRASONIC WAVE ADHESION, AND ELECTRONIC PARTS CONNECTION METHOD USING SAME
#316Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus
#317Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
#318CHIP-ON-CHIP STRUCTURE AND MANUFACTURING METHOD THEROF
#319No flow underfill
#320STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR MAKING THE SAME
#321Electronic Apparatus Manufacturing Method, Electronic Component, and Electronic Apparatus
#322FLIP-CHIP BONDING METHOD TO REDUCE VOIDS IN UNDERFILL MATERIAL
#323Semiconductor device and method for manufacturing the same
#324METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE INCLUDING EXPOSING A DICING LINE ON A WAFER
#325Semiconductor package
#326Semiconductor package structure and manufacturing process thereof
#327Flip chip bonder head for forming a uniform fillet
#328Component arrangement and method for production thereof
#329Semiconductor device having a semiconductor chip, and method for the production thereof
#330Microelectronic packages with nanoparticle joining
#331Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
#332Semiconductor device and manufacturing method thereof
#333INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP MOUNTING AND METHOD OF MANUFACTURE THEREOF
#334Method for Making Die Assemblies
#335CONVEX DIE ATTACHMENT METHOD
#336Semiconductor device, method for manufacturing the same, and electronic device
#337Scalable transfer-join bonding lock-and-key structures
#338Positive-type photosensitive resin composition, method for producing resist pattern, semiconductor device, and electronic device
#339Manufacturing method for electronic devices
#340METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION
#341Method of manufacturing semiconductor device
#342EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
#343Wafer level integrated interconnect decal and manufacturing method thereof
#344ELECTRONIC DEVICE, PACKAGE INCLUDING THE SAME AND METHOD OF FABRICATING THE PACKAGE
#345Electronic component package and method for producing electronic component package
#346Flip chip mounting method and bump forming method
#347Co-axial restraint for connectors within flip-chip packages
#348ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#349METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME
#350ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#351ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#352Flip-chip underfill
#353Integrated (multilayer) circuits and process of producing the same
#354Microelectronic devices and methods for manufacturing microelectronic devices
#355Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument
#356Method and structure for bonding flip chip
#357Apparatus and methods of forming an interconnect between a workpiece and substrate
#358SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#359Ultra thin bumped wafer with under-film
#360Ultra thin bumped wafer with under-film
#361FLEXIBLE CIRCUIT MODULE
#362Surface-mounted silicon chip
#363Multi-function tape for a semiconductor package and method of manufacturing a semiconductor device using the same
#364Method for fabricating a semiconductor package
#365Electrical connection and method of manufacturing the same
#366Method of manufacturing semiconductor device including exposing a dicing line on a wafer
#367Semiconductor device having a semiconductor chip, and method for the production thereof
#368Stress-engineered interconnect packages with activator-assisted molds
#369Manufacturing method for electronic devices
#370Method of making electronic device
#371Semiconductor package and method of packaging semiconductor devices
#372Electrical interconnect forming method
#373Electrical interconnect forming method
#374Electrical interconnect structure
#375Grooving bumped wafer pre-underfill system
#376METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE
#377Manufacturing method of semiconductor device
#378SEMICONDUCTOR APPARATUS AND PROCESS OF PRODUCTION THEREOF
#379LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM
#380Bonding IC die to TSV wafers
#381Fabricating process of a chip package structure
#382Method for fabricating flip-attached and underfilled semiconductor devices
#383MULTI CHIP STACKING WITH RELIABLE JOINING
#384Method for bonding semiconductor wafers and method for manufacturing semiconductor device
#385WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES
#386Electronic Device and Manufacturing Method for Electronic Device
#387Adhesive for connection of circuit member and semiconductor device using the same
#388Packaging structure, method for manufacturing the same, and method for using the same
#389PROCESS FOR COATING A BUMPED SEMICONDUCTOR WAFER
#390Composition and methods of forming solder bump and flip chip using the same
#391Chip-level underfill method of manufacture
#392Production method of semiconductor device and bonding film
#393Method for stacking devices
#394SEMICONDUCTOR DEVICE
#395METHOD FOR FABRICATING ELECTRONIC DEVICE HAVING FIRST SUBSTRATE WITH FIRST RESIN LAYER AND SECOND SUBSTRATE WITH SECOND RESIN LAYER ADHERED TO THE FIRST RESIN LAYER
#396MOLDED DIELECTRIC LAYER IN PRINT-PATTERNED ELECTRONIC CIRCUITS
#397Apparatus and methods of forming an interconnect between a workpiece and substrate
#398Process for Preparing a Solder Stand-Off
#399Composite interconnect
#400Method of fabricating bonding structure
#401Method and system for collecting alignment data from coated chips or wafers
#402Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
#403Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#404Method for processing a base that includes connecting a first base to a second base with an insulating film
#405Packaging structure, method for manufacturing the same, and method for using the same
#406Method for processing a base that includes connecting a first base to a second base
#407CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
#408Method of manufacturing a semiconductor device
#409Manufacturing method for electronic devices
#410FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF
#411METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD
#412SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME
#413Wafer-level chip scale package and method for fabricating and using the same
#414WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN
#415Alignment Marks on the Edge of Wafers and Methods for Same
#416Semiconductor device and method of forming interconnect structure in non-active area of wafer
#417Semiconductor package, apparatus and method for manufacturing the semiconductor package, and electronic device equipped with the semiconductor package
#418Sheet-Like Underfill Material and Semiconductor Device Manufacturing Method
#419Bonding method of semiconductor and laminated structure fabricated thereby
#420Flip-chip type semiconductor device
#421Noncontact information storage medium and method for manufacturing same
#422Electronic assembly having a multilayer adhesive structure
#423Electronic device and method of manufacturing same
#424Flip chip mounting method and bump forming method
#425Method and apparatus for fabricating integrated circuit device using self-organizing function
#426Grooving bumped wafer pre-underfill system
#427Stack circuit member and method
#428Method for manufacturing semiconductor package
#429Ultra thin bumped wafer with under-film
#430CONVEX DIE ATTACHMENT METHOD
#431Chip package
#432Fabricating process of a chip package structure
#433Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same
#434Semiconductor device and manufacturing method thereof
#435Electrical interconnect structure and method
#436Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition
#437Semiconductor device and manufacturing method thereof
#438Techniques for forming interconnects
#439Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
#440Flip chip mounting method by no-flow underfill
#441Molded dielectric layer in print-patterned electronic circuits
#442Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same
#443Chip and manufacturing method and application thereof
#444THERMOPLASTIC FLUXING UNDERFILL COMPOSITION
#445THERMOPLASTIC FLUXING UNDERFILL METHOD
#446Bonding structure
#447METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE
#448Thin flip-chip method
#449METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
#450Flip-chip type semiconductor device
#451Wafer bonding of damascene-patterned metal/adhesive redistribution layers
#452Plurality of devices attached by solder bumps
#453Wiring board with conductive wirings and protrusion electrodes
#454Microelectronic devices and methods for manufacturing microelectronic devices
#455Wafer-level processing of chip-packaging compositions including bis-maleimides
#456Method of producing a semiconductor device, and wafer-processing tape
#457Methods for fabricating protective layers on semiconductor device components
#458Apparatus incorporating small-feature-size and large-feature-size components and method for making same
#459Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding
#460Method of coating contacts on a surface of a flip chip
#461Semiconductor device having a semiconductor chip, and method for the production thereof
#462Electronic circuit chip, and electronic circuit device and method for manufacturing the same
#463Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
#464Display panel package
#465Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography
#466Electronic component unit
#467Flip-chip packaging of a photo-sensor die on a transparent substrate
#468Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
#469Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
#470Stack circuit member and method
#471Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#472Wafer level pre-packaged flip chip systems
#473Wafer level pre-packaged flip chip
#474Wafer level pre-packaged flip chip
#475Wafer level pre-packaged flip chip system
#476Method for fabricating a flip chip package
#477Electronic device and method for fabricating the same
#478Method for fabricating flip-attached and underfilled semiconductor devices
#479Methods for packing microfeature devices and microfeature devices formed by such methods
#480Underfill method
#481Microfeature devices and methods for manufacturing microfeature devices
#482Microfeature devices and methods for manufacturing microfeature devices
#483Semiconductor component sealed on five sides by polymer sealing layer
#484Semiconductor device and process for producing the same
#485Hot-Melt Underfill Composition and Methos of Application
#486Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#487Three-dimensional device fabrication method
#488Wafer-level underfill process making use of sacrificial contact pad protective material
#489Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts
#490Flip-chip semiconductor device utilizing an elongated tip bump
#491Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#492Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method
#493Fabricating method of wafer protection layers
#494Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device
#495Methods for packaging microfeature devices and microfeature devices formed by such methods
#496Method for processing a base that includes connecting a first base to a second base with an insulating film
#497Method for processing base
#498Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device
#499Methods of bonding two semiconductor devices
#500Microfeature devices and methods for manufacturing microfeature devices
#501Underfill and encapsulation of semiconductor assemblies with materials having differing properties
#502Semiconductor component and system having thinned, encapsulated dice
#503Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#504Method of connecting base materials
#505Method for fabricating encapsulated semiconductor components
#506Electronic component mounting method and apparatus
#507Electronic package having a sealing structure on predetermined area, and the method thereof
#508Semiconductor flip-chip package and method for the fabrication thereof
#509Integrated circuit die and substrate coupling
#510Thin flip-chip method
#511Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
#512Device mounting method and device transport apparatus
#513Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#514Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
#515Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
#516Resin composition for encapsulating semiconductor
#517Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#518Electronic component mounting method and apparatus
#519Encapsulated semiconductor components and methods of fabrication
#520Method for preparing arylphosphonite antioxidant
#521Method of making a microelectronic assembly
#522Combination back grind tape and underfill for flip chips
#523Method and apparatus for a dual substrate package
#524Resin composition for encapsulating semiconductor device
#525Head assembly, disk unit, and bonding method and apparatus
#526Nano-filled composite materials with exceptionally high glass transition temperature
#527Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device
#528Integrated underfill process for bumped chip assembly
#529Underfill method
#530Wafer-level chip scale package and method for fabricating and using the same
#531Method of surface-mounting semiconductor chip on PCB
#532Laminated sheet
#533Pre-back-grind and underfill layer for bumped wafers and dies
#534Methods of forming integrated circuitry
#535Semiconductor device package and manufacturing method thereof