210165 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on different surfaces Layer and strap connectors
Switching device and electronic circuit
#302Stacked half-bridge package
#303Composite substrate with alternating pattern of diamond and metal or metal alloy
#304Semiconductor module
#305Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#306Semiconductor device and manufacturing method thereof
#307Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#308Semiconductor component having inner and outer semiconductor component housings
#309Power semiconductor device
#310Electronic module and method for producing an electronic module
#311SEMICONDUCTOR PACKAGE APPARATUS
#312Semiconductor module and semiconductor device
#313Stacked synchronous buck converter having chip embedded in outside recess of leadframe
#314Conductor strip with contact areas having cutouts
#315Power semiconductor device with small contact footprint and the preparation method
#316Semiconductor module
#317Molded chip package and method of manufacturing the same
#318Semiconductor device and automobile
#319Power semiconductor module with switching device and assembly
#320Semiconductor module
#321Semiconductor module package and method of manufacturing the same
#322Semiconductor module
#323Semiconductor devices and methods of making the same
#324High reliability semiconductor package structure
#325Electric power semiconductor device
#326Semiconductor device having multiple contact clips
#327Semiconductor apparatus
#328Chip stack structure using conductive film bridge adhesive technology
#329Method of making stacked multi-chip packaging structure
#330Array based fabrication of power semiconductor package with integrated heat spreader
#331Semiconductor module for electric power
#332Semiconductor device package
#333Power module package
#334Semiconductor device and method for manufacturing the same
#335Semiconductor module and method for manufacturing the same
#336Power semiconductor device
#337Multichip power semiconductor device
#338Power semiconductor package with gate and field electrode leads
#339Electronic device
#340Substrateless power device packages
#341Lead frame having a perimeter recess within periphery of component terminal
#342Multichip device including a substrate
#343Semiconductor module
#344Power semiconductor module
#345Semiconductor package
#346Semiconductor device
#347Bonding structure and method
#348Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims
#349III-nitride rectifier package
#350Lead frame strips with support members
#351Detection of defective electrical connections
#352Multi-level semiconductor package
#353Semiconductor device and method of manufacturing the same
#354Power converter
#355Multi-chip semiconductor power device
#356Method for fabricating stack die package
#357Switching element unit
#358Semiconductor device
#359Switching element with a series-connected junction FET (JFET) and MOSFET achieving both improved withstand voltage and reduced on-resistance
#360Semiconductor device and method of manufacturing the same
#361Power transistor arrangement and method for manufacturing the same
#362Method for producing semiconductor device
#363Power module
#364Method for top-side cooled semiconductor package with stacked interconnection plates
#365Semiconductor device and method for producing the same
#366Power module and method of manufacturing the power module
#367Semiconductor device having sensing functionality
#368Semiconductor device and method of manufacturing same
#369Semiconductor packaging method using connecting plate for internal connection
#370Method for electrophoretically depositing a film on an electronic assembly
#371Semiconductor package with connecting plate for internal connection
#372Electronic device and semiconductor device
#373Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same
#374Top exposed semiconductor chip package
#375Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#376Component and method of manufacturing a component using an ultrathin carrier
#377Electronic component and method of manufacturing electronic component
#378Package-in-packages and methods of formation thereof
#379Lead Frame Packages and Methods of Formation Thereof
#380Electric device package and method of making an electric device package
#381Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device
#382Reliable area joints for power semiconductors
#383Semiconductor device
#384Semiconductor device having improved thermal properties
#385Power module
#386Multichip power semiconductor device
#387Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package
#388Semiconductor device
#389Power semiconductor module and power unit device
#390Semiconductor device and method for manufacturing semiconductor device
#391Stacked half-bridge package with a common leadframe
#392Power semiconductor module
#393Semiconductor device using diffusion soldering
#394Module including a discrete device mounted on a DCB substrate
#395Method of forming a semiconductor device and leadframe therefor
#396Power semiconductor package with conductive clip
#397Semiconductor device including cladded base plate
#398Method for packaging ultra-thin chip with solder ball thermo-compression in wafer level packaging process
#399SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#400SEMICONDUCTOR DEVICE
#401Semiconductor device
#402Semiconductor device including cladded base plate
#403POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#404Small-Outline Package for a Power Transistor
#405High performance power transistor having ultra-thin package
#406Semiconductor device
#407Power semiconductor chip having two metal layers on one face
#408SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#409SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#410SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#411Semiconductor device including a contact clip having protrusions and manufacturing thereof
#412Semiconductor die package and method for making the same
#413Power package including multiple semiconductor devices
#414Multi-component power structures and methods for forming the same
#415Semiconductor device including excess solder
#416High voltage cascoded III-nitride rectifier package utilizing clips on package surface
#417POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF
#418Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer
#419SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#420IGBT power semiconductor package having a conductive clip
#421Power converter
#422Semiconductor device
#423Stacked half-bridge package with a common conductive leadframe
#424Semiconductor device and method for manufacturing the same
#425Top exposed package and assembly method
#426Clip interconnect with encapsulation material locking feature
#427Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology
#428Semiconductor module having an insert and method for producing a semiconductor module having an insert
#429Power package module with low and high power chips and method for fabricating the same
#430Substrateless power device packages
#431POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE
#432Semiconductor die package including low stress configuration
#433Multi-chip semiconductor packages and assembly thereof
#434Semiconductor device
#435Semiconductor module including a switch and non-central diode
#436SEMICONDUCTOR DEVICE AND POWER SEMICONDUCTOR DEVICE
#437Connector assembly and method of manufacture
#438Semiconductor component and method of manufacture
#439Semiconductor module and method for production thereof
#440Electrical connection device
#441Semiconductor encapsulation and method thereof
#442BONDING STRUCTURE AND METHOD
#443Power module
#444Semiconductor module and method of manufacturing the same
#445Semiconductor device attached to island having protrusion
#446Combined packaged power semiconductor device
#447Semiconductor component and method of manufacture
#448Method for manufacturing a semiconductor component and structure therefor
#449Power semiconductor device
#450Multi-layer lead frame package and method of fabrication
#451Semiconductor packaging and fabrication method using connecting plate for internal connection
#452Semiconductor device
#453Semiconductor device and method of manufacturing the same
#454Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs
#455Semiconductor arrangement
#456Semiconductor device and method for manufacturing the same
#457Semiconductor device
#458Semiconductor die package and method for making the same
#459Semiconductor die package including low stress configuration
#460Top-side cooled semiconductor package with stacked interconnection plates and method
#461Power semiconductor module
#462Semiconductor module including a switch and non-central diode
#463Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier
#464Electronic device and method of manufacturing same
#465Power semiconductor device
#466Flex chip connector for semiconductor device
#467Semiconductor device and method
#468SEMICONDUCTOR DEVICE
#469Manufacturing method of resin-sealed semiconductor device
#470Module with stacked semiconductor devices
#471Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same
#472Flex clip connector for semiconductor device
#473Power semiconductor module
#474Semiconductor device with welded leads and method of manufacturing the same
#475Methods of packaging a semiconductor die and package formed by the methods
#476Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
#477SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#478Power semiconductor module
#479Multi-chip module
#480Power semiconductor apparatus
#481Semiconductor package structure having enhanced thermal dissipation characteristics
#482Semiconductor package structure and method of manufacture
#483Heat dissipation substrate for multi-chip package
#484Semiconductor device having compliant and crack-arresting interconnect structure
#485Power semiconductor module having low gate drive inductance flexible board connection