210168 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being of different types provided for in two or more of groups; Location after the connecting process on different surfaces Layer and TAB connectors
SEMICONDUCTOR PACKAGE
#2Semiconductor device packaging assembly, lead frame strip and unit lead frame with trenches or grooves for guiding liquefied molding material
#3Fan-out semiconductor package
#4Power electronics assembly having an adhesion layer, and method for producing said assembly
#5Semiconductor device packaging assembly, lead frame strip and unit lead frame with molding compound channels
#6Apparatus for the material-bonded connection of connection partners of a power-electronics component
#7Method for producing a switching device with a moisture-tight and electrically insulating cover and for producing an arrangement therewith
#8Lead frame strips with electrical isolation of die paddles
#9Electronic Module
#10Magnetic integration double-ended converter
#11Semiconductor device with surface electrodes