Patents-Review.com
ClassID:

210271 ⎘

H01L2224/75754 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for aligning Guiding structures

Sub-classes:
Recent Application in this class:
#1
20240395767
2024-11-28

TOOLS AND SYSTEMS FOR PROCESSING SEMICONDUCTOR DEVICES, AND METHODS OF PROCESSING SEMICONDUCTOR DEVICES

 #2
20220302079
2022-09-22

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

 #3
20210351154
2021-11-11

Mass transfer device and mass transfer method

 #4
20210305201
2021-09-30

Bonding apparatus and method of fabricating display device using the same

 #5
20210013079
2021-01-14

Apparatus, system, and method for handling aligned wafer pairs

 #6
20190333798
2019-10-31

Alignment mechanism, chuck device, and bonder

 #7
20180358325
2018-12-13

System for processing semiconductor devices

 #8
20170372925
2017-12-28

System and related techniques for handling aligned substrate pairs

 #9
20170278835
2017-09-28

LED chip mounting apparatus and method of manufacturing display apparatus by using the LED chip mounting apparatus

 #10
20170179067
2017-06-22

Semiconductor package alignment frame for local reflow

 #11
20170066075
2017-03-09

Pressure applying unit

 #12
20160336212
2016-11-17

Apparatus, system, and method for handling aligned wafer pairs

 #13
20160315184
2016-10-27

Semiconductor device, and alternator and power conversion device which use same

 #14
20160225730
2016-08-04

Electrode connection structure and electrode connection method

 #15
20150201537
2015-07-16

Chip attach frame

 #16
20150171051
2015-06-18

Tools and systems for processing semiconductor devices, and methods of processing semiconductor devices

 #17
20150097022
2015-04-09

Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials

 #18
20150087083
2015-03-26

Bonding apparatus

 #19
20140331462
2014-11-13

Packaging process tools and packaging methods for semiconductor devices

 #20
20140091509
2014-04-03

Methods for forming 3DIC package

 #21
20130207250
2013-08-15

Chip attach frame

 #22
20130143361
2013-06-06

Packaging process tools and systems, and packaging methods for semiconductor devices

 #23
20130137215
2013-05-30

Die fixing method and apparatus

 #24
20130115752
2013-05-09

Pick-and-place tool for packaging process

 #25
20130095608
2013-04-18

Methods for forming 3DIC package

 #26
20130089952
2013-04-11

Packaging process tools and packaging methods for semiconductor devices

 #27
20120202322
2012-08-09

Assembly jig for a semiconductor device and assembly method for a semiconductor device

 #28
20110049702
2011-03-03

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

 #29
20100024667
2010-02-04

PRESSURE-HEATING APPARATUS AND METHOD

 #30
20090314437
2009-12-24

Compression bonding device

 #31
20090032570
2009-02-05

Compression bonding device and a mounting method