Patents-Review.com
ClassID:

210273 ⎘

H01L2224/75756 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with bump connectors or layer connectors; Means for aligning; Guiding structures in the upper part of the bonding apparatus, e.g. in the bonding head

Recent Application in this class:
#1
20240329125
2024-10-03

METHOD FOR POSITIONING SEMICONDUCTOR DEVICES AND CORRESPONDING POSITIONING APPARATUS

 #2
20220406747
2022-12-22

Bonding apparatus and bonding method

 #3
20210272926
2021-09-02

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

 #4
20210249378
2021-08-12

Ball disposition system, method of disposing a ball on a substrate and method of manufacturing semiconductor device

 #5
20200243477
2020-07-30

DIE BONDING APPARATUS AND DIE BONDING METHOD

 #6
20190229084
2019-07-25

Bonding tools for bonding machines, bonding machines for bonding semiconductor elements, and related methods

 #7
20190198376
2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #8
20190198375
2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #9
20190198374
2019-06-27

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #10
20190131271
2019-05-02

Chip bonding apparatus, chip bonding method and a chip package structure

 #11
20180197833
2018-07-12

Semiconductor device and manufacturing method of semiconductor device

 #12
20180174881
2018-06-21

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #13
20180082974
2018-03-22

Circuit pin positioning structure, fabrication method of soldered circuit elements, and method of forming circuit pins of a stacked package

 #14
20170162534
2017-06-08

Chip attach frame

 #15
20160293522
2016-10-06

Au-based solder die attachment semiconductor device and method for manufacturing the same

 #16
20160027694
2016-01-28

Wafer level flat no-lead semiconductor packages and methods of manufacture

 #17
20150348933
2015-12-03

Apparatus for molecular adhesion bonding with compensation for radial misalignment

 #18
20150041525
2015-02-12

Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig

 #19
20130210171
2013-08-15

Method for molecular adhesion bonding with compensation for radial misalignment

 #20
20130207250
2013-08-15

Chip attach frame

 #21
20120298310
2012-11-29

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

 #22
20120279653
2012-11-08

Heating apparatus and implemented body manufacturing method

 #23
20120247664
2012-10-04

Bonding apparatus and bonding method

 #24
20120153453
2012-06-21

Metallic thermal joint for high power density chips

 #25
20120077329
2012-03-29

Direct bonding method with reduction in overlay misalignment

 #26
20120006463
2012-01-12

Method for molecular adhesion bonding with compensation for radial misalignment

 #27
20100186894
2010-07-29

Method for packing electric components on a substrate

 #28
20100181667
2010-07-22

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

 #29
20090038753
2009-02-12

Mounting method

 #30
20090014498
2009-01-15

COMPRESSION BONDING DEVICE

 #31
20070089291
2007-04-26

Electronic part mounting substrate and method for producing same

 #32
20050047101
2005-03-03

Electronic part mounting substrate and method for producing same