H01L2224/76264 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for applying energy, e.g. heating means by induction heating, i.e. coils

• H01L2224/76265 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
• H01L2224/76266 » in the upper part of the bonding apparatus 0