H01L2224/7625 - CPC Classification Index

ClassID:

210326 ⎘

H01L2224/7625 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects Means for applying energy, e.g. heating means

Sub-classes:

H01L2224/76251 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
H01L2224/76252 » in the upper part of the bonding apparatus 2
H01L2224/76253 » adapted for localised heating 0
H01L2224/7626 » Polychromatic heating lamp 0
H01L2224/76261 » Laser 1
H01L2224/76264 » by induction heating, i.e. coils 0
H01L2224/76267 » Flame torch, e.g. hydrogen torch 0
H01L2224/76268 » Discharge electrode 1
H01L2224/76272 » Oven 1
H01L2224/7628 » Resistance welding electrodes, i.e. for ohmic heating 0
H01L2224/76283 » by infrared heating, e.g. infrared heating lamp 0
H01L2224/763 » by means of pressure 0

Recent Application in this class:

20160020194

2016-01-21

Electronic sub-assembly and method for the production of an electronic sub-assembly