H01L2224/76268 - CPC Classification Index

ClassID:

210338 ⎘

H01L2224/76268 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with build-up interconnects; Means for applying energy, e.g. heating means Discharge electrode

Sub-classes:

H01L2224/76269 » Shape of the discharge electrode 0
H01L2224/7627 » Material of the discharge electrode 0
H01L2224/76271 » Circuitry of the discharge electrode 0

Recent Application in this class:

20130180757

2013-07-18

Bonding structure of multilayer copper bonding wire