ClassID:

210482

H01L2224/776 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors Means for supplying the connector to be connected in the bonding apparatus

Sub-classes:
Recent Application in this class: