H01L2224/777 - CPC Classification Index

ClassID:

210493 ⎘

H01L2224/777 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors Means for aligning

Sub-classes:

H01L2224/77701 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 1
H01L2224/77702 » in the upper part of the bonding apparatus, e.g. in the wedge 2
H01L2224/77703 » Mechanical holding means 3
H01L2224/77723 » Electrostatic holding means 0
H01L2224/77733 » Magnetic holding means 1
H01L2224/77743 » Suction holding means 0
H01L2224/77753 » Means for optical alignment, e.g. sensors 0
H01L2224/77754 » Guiding structures 1

Recent Application in this class:

20120119343

2012-05-17

Stacked leadframe implementation for DC/DC convertor power module incorporating a stacked controller and stacked leadframe construction methodology