210485 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for supplying the connector to be connected in the bonding apparatus Holding means, e.g. wire clampers
Sub-classes:APPARATUS FOR BONDING CLIP, METHOD OF BONDING CLIP, AND SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP TO WHICH CLIP IS BONDED USING THE METHOD
#2Clip bond semiconductor packages and assembly tools
#3Electrically conductive pattern printer for downhole tools