H01L2224/77703 - CPC Classification Index

ClassID:

210496 ⎘

H01L2224/77703 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for aligning Mechanical holding means

Sub-classes:

H01L2224/77704 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 6
H01L2224/77705 » in the upper part of the bonding apparatus, e.g. in the wedge 3

Recent Application in this class:

20190160488

2019-05-30

Electrically conductive pattern printer for downhole tools

20180158757

2018-06-07

Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module

20110163431

2011-07-07

Semiconductor device and method of manufacturing the same