H01L2224/77733 - CPC Classification Index

ClassID:

210502 ⎘

H01L2224/77733 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for aligning Magnetic holding means

Sub-classes:

H01L2224/77734 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
H01L2224/77735 » in the upper part of the bonding apparatus, e.g. in the wedge 1

Recent Application in this class:

20220076980

2022-03-10

Substrate bonding apparatus and method of manufacturing a semiconductor device