H01L2224/77754 - CPC Classification Index

ClassID:

210509 ⎘

H01L2224/77754 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with strap connectors; Means for aligning Guiding structures

Sub-classes:

H01L2224/77755 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 1
H01L2224/77756 » in the upper part of the bonding apparatus, e.g. in the wedge 0

Recent Application in this class:

20230154889

2023-05-18

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND JIG SET