H01L2224/78754 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for aligning Guiding structures

• H01L2224/78755 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 1
• H01L2224/78756 » in the upper part of the bonding apparatus, e.g. in the capillary or wedge 6