ClassID:

210617

H01L2224/78756 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for aligning; Guiding structures in the upper part of the bonding apparatus, e.g. in the capillary or wedge

Recent Application in this class: