210620 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for moving parts; Lower part of the bonding apparatus, e.g. XY table Rotational mechanism
Sub-classes:METHOD OF USING PROCESSING OVEN
#2HANDLING A FRAGILE SUBSTRATE FOR INTERCONNECT BONDING
#3METHOD OF USING PROCESSING OVEN
#4Wire bonding method and wire bonding apparatus
#5Bonding process with rotating bonding stage
#6Bonding apparatus with rotating bonding stage
#7Semiconductor device, and alternator and power conversion device which use same
#8Wire bonding apparatus and bonding method