210621 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for connecting with wire connectors; Means for moving parts; Lower part of the bonding apparatus, e.g. XY table; Rotational mechanism Pivoting mechanism
Bonding process with rotating bonding stage
#2Y-theta table for semiconductor equipment
#3Bonding method
#4Bonding apparatus with rotating bonding stage
#5Semiconductor device manufacturing method, semiconductor device, and wire bonding apparatus
#6Manufacturing method for physical quantity sensor using lead frame and bonding device therefor