H01L2224/7918 - CPC Classification Index

ClassID:

210660 ⎘

H01L2224/7918 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for applying permanent coating Means for blanket deposition

Sub-classes:

H01L2224/79181 » for spin coating, i.e. spin coater 0
H01L2224/79182 » for curtain coating 0
H01L2224/79183 » for immersion coating, i.e. bath 0
H01L2224/79184 » for spray coating, i.e. nozzle 0
H01L2224/79185 » Means for physical vapour deposition [PVD], e.g. evaporation, sputtering 0
H01L2224/79186 » Means for sputtering, e.g. target 0
H01L2224/79187 » Means for evaporation 0
H01L2224/79188 » Means for chemical vapour deposition [CVD], e.g. for laser CVD 0
H01L2224/79189 » Means for plating, e.g. for electroplating, electroless plating 0