ClassID:

210665

H01L2224/79185 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for applying permanent coating; Means for blanket deposition Means for physical vapour deposition [PVD], e.g. evaporation, sputtering