H01L2224/7925 - CPC Classification Index

ClassID:

210671 ⎘

H01L2224/7925 - CPC Classification

Classification description:

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB] Means for applying energy, e.g. heating means

Sub-classes:

H01L2224/79251 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 2
H01L2224/79252 » in the upper part of the bonding apparatus, e.g. in the pressing head 2
H01L2224/79253 » adapted for localised heating 0
H01L2224/7926 » Polychromatic heating lamp 0
H01L2224/79261 » Laser 0
H01L2224/79264 » by induction heating, i.e. coils 0
H01L2224/79267 » Flame torch, e.g. hydrogen torch 0
H01L2224/79268 » Discharge electrode 0
H01L2224/79272 » Oven 0
H01L2224/7928 » Resistance welding electrodes, i.e. for ohmic heating 0
H01L2224/79283 » by infrared heating, e.g. infrared heating lamp 0
H01L2224/793 » by means of pressure 1