H01L2224/7928 - CPC Classification

Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto; Apparatus for Tape Automated Bonding [TAB]; Means for applying energy, e.g. heating means Resistance welding electrodes, i.e. for ohmic heating

• H01L2224/79281 » in the lower part of the bonding apparatus, e.g. in the apparatus chuck 0
• H01L2224/79282 » in the upper part of the bonding apparatus, e.g. in the pressing head 0